High mobility stabile metal oxide TFT
A method of fabricating a stable, high mobility metal oxide thin film transistor includes the steps of providing a substrate, positioning a gate on the substrate, and depositing a gate dielectric layer on the gate and portions of the substrate not covered by the gate. A multiple film active layer including a metal oxide semiconductor film and a metal oxide passivation film is deposited on the gate dielectric with the passivation film positioned in overlying relationship to the semiconductor film. An etch-stop layer is positioned on a surface of the passivation film and defines a channel area in the active layer. A portion of the multiple film active layer on opposite sides of the etch-stop layer is modified to form an ohmic contact and metal source/drain contacts are positioned on the modified portion of the multiple film active layer.
1. A method of fabricating a stable, high mobility metal oxide thin film transistor comprising the steps of:
providing a substrate;
positioning a gate on an upper surface of the substrate;
depositing a gate dielectric layer on the gate and portions of the substrate not covered by the gate;
forming a multiple film active layer on the gate dielectric layer, the multiple film active layer including a metal oxide semiconductor film and a metal oxide passivation film with the metal oxide passivation film being positioned in overlying relationship to the metal oxide semiconductor film, the metal oxide passivation film having an upper surface and including AlZnO, and the metal oxide semiconductor film including metal oxide semiconductor other than AlZnO;
depositing an etch-stop layer on the upper surface of the metal oxide passivation film of the multiple film active layer, the etch-stop layer defining a channel area in the multiple film active layer;
modifying a portion of the upper surface of the metal oxide passivation film of the multiple film active layer on opposite sides of the etch-stop layer including exposing the upper surface of the metal oxide passivation film to a basic material to remove the aluminum in the metal oxide passivation film adjacent the upper surface; and
positioning metal source/drain contacts on the modified portion of the upper surface of the metal oxide passivation film of the multiple film active layer.
2. A method as claimed in claim 1 wherein the step of modifying a portion of the multiple film active layer includes altering the conductivity of at least the upper surface of the metal oxide passivation film in contact with the metal source/drain contacts to form an ohmic contact between the metal oxide passivation film and the metal source/drain contacts.
3. A method as claimed in claim 2 wherein the step of depositing an etch-stop layer includes a photolithographic patterning process including the use of the basic material and the step of altering the conductivity includes exposing a surface of the metal oxide passivation film on opposite sides of the etch-stop layer to the basic material.
4. In a metal oxide thin film transistor including a substrate, a gate positioned on the substrate, a gate dielectric layer positioned on the gate and portions of the substrate not covered by the gate, an active layer positioned on the gate dielectric layer, and an etch-stop layer positioned on the active layer so as to define a channel area in the active layer, a method of fabricating a stable, high mobility active layer comprising the steps of:
forming the active layer with a plurality of films including a metal oxide semiconductor film and a metal oxide passivation film, the metal oxide passivation film having a major upper surface and including aluminum;
positioning the metal oxide passivation film between the metal oxide semiconductor film and the etch-stop layer;
modifying a portion of the major upper surface of the metal oxide passivation film including treating the aluminum with a base material to remove the aluminum from the portion of the major upper surface of the metal oxide passivation film to increase the conductivity, the base material being other than gas-phase ammonia; and
positioning metal source/drain contacts on the modified portion of the major upper surface of the metal oxide passivation film.
5. A method as claimed in claim 4 wherein the step of forming the active layer includes forming the metal oxide semiconductor film with a higher mobility and lower stability than the metal oxide passivation film.
6. A method as claimed in claim 4 further including a step of modifying at least the major upper surface of the metal oxide passivation film in contact with the metal source/drain contacts, prior to positioning the metal source/drain contacts on the major upper surface of the metal oxide passivation film, to form an ohmic contact between the metal oxide passivation film and the metal source/drain contacts.