Packaging method of light emitting device
A packaging method includes the following steps. A cover substrate is provided. A blocking dam having a first height is formed in the peripheral region of the cover substrate. The blocking dam has a second height after being hardened. A sealant surrounding the blocking dam and having a third height is formed. An encapsulation glue is filled in the active region of the cover substrate, and blocked by the blocking dam. A device substrate is provided, and a compression process is performed on the device substrate and the cover substrate. After the compression process, a buffer space is formed between the blocking dam and the sealant and between the cover substrate and the device substrate to accommodate the encapsulation glue spilling out of the active region of the cover substrate. The sealant is hardened, so that the cover substrate and the device substrate are bonded together through the sealant.
1. A packaging method of a light emitting device, comprising:
providing a cover substrate, wherein the cover substrate has an active region and a peripheral region surrounding the active region;
forming a blocking dam in the peripheral region of the cover substrate, wherein the blocking dam has a first height and substantially surrounds the active region of the cover substrate;
performing a first hardening process on the blocking dam to harden the blocking dam, and the blocking dam after hardened has a second height;
forming a sealant in the peripheral region of the cover substrate, wherein the sealant substantially surrounds the blocking dam, the sealant has a third height, and the third height is greater than the second height;
filling an encapsulation glue in the active region of the cover substrate, wherein the encapsulation glue is blocked by the blocking dam, and substantially disposed in the active region of the cover substrate;
providing a device substrate, wherein the device substrate has an active region and a peripheral region surrounding the active region, and at least a light emitting device is disposed in the active region of the device substrate;
corresponding the active region of the device substrate to the active region of the cover substrate, corresponding the peripheral region of the device substrate to the peripheral region of the cover substrate, performing a compression process on the device substrate and the cover substrate, and contacting the sealant on the cover substrate to the device substrate, wherein after the compression process, a buffer space is formed between the blocking dam and the sealant and between the cover substrate and the device substrate to accommodate the encapsulation glue spilling out of the active region of the cover substrate; and
performing a second hardening process on the sealant to bond the cover substrate and the device substrate together through the sealant.
2. The packaging method of the light emitting device of claim 1 , wherein after the compression process, the sealant is squeezed by the device substrate to substantially have the second height identical to the blocking dam.
3. The packaging method of the light emitting device of claim 1 , wherein the blocking dam has an enclosed pattern.
4. The packaging method of the light emitting device of claim 1 , wherein the first hardening process comprises a light exposing process or a thermal process.
5. The packaging method of the light emitting device of claim 1 , wherein the second hardening process comprises a light exposing process or a thermal process.
6. The packaging method of the light emitting device of claim 1 , wherein the first height is substantially between 6 micrometers and 20 micrometers.
7. The packaging method of the light emitting device of claim 1 , wherein the second height is substantially between 5 micrometers and 20 micrometers.
8. The packaging method of the light emitting device of claim 1 , wherein the third height is substantially between 10 micrometers and 25 micrometers.