Solder ball bridge, and methods of making
An electrical connection between a first element and a second element formed by a solder ball bridge having at least three solder balls in physical contact with each other extending to electrically connect the first element and the second element. The solder ball bridge is particularly suitable for a disc drive system, to form an electrical connection between two elements such as between a piezoelectric microactuator element and the suspension assembly. Methods of making a solder ball bridge are also provided.
1. An electrical connection between a surface of a first element and a surface of a second element having a gap therebetween, the electrical connection comprising at least three solder balls in physical contact with each other, and extending across the gap to electrically connect the surface of the first element and the surface of the second element.
2. The electrical connection of claim 1 comprising at least five solder balls in physical contact with each other, the first element and the second element.
3. The electrical connection of claim 1 wherein each of the solder balls has a diameter of 30 to 150 micrometers.
4. The electrical connection of claim 1 wherein each of the solder balls has a diameter of 50 to 100 micrometers.
5. The electrical connection of claim 1 wherein the gap is at least 10 micrometers.
6. The electrical connection of claim 1 wherein the surface of the first element and the surface of the second element are co-planar.
7. The electrical connection of claim 1 wherein the surface of the first element and the surface of the second element are non-planar to each other.
8. The electrical connection of claim 7 wherein the surface of the first element and the surface of the second element are parallel to each other.
9. The electrical connection of claim 7 wherein the surface of the first element and the surface of the second element are orthogonal to each other.
10. A disc drive comprising:
a first element and a second element physically spaced from the first element; and
a solder ball bridge electrically connecting a surface of the first element with a surface of the second element, the solder ball bridge comprising at least three solder balls.
11. The disc drive of claim 10 wherein the solder ball bridge comprises at least five solder balls.
12. The disc drive of claim 10 wherein each of the solder balls has a diameter of 50 to 100 micrometers.
13. The disc drive of claim 10 wherein the first element is a piezoelectric microactuator.
14. The disc drive of claim 10 wherein the surface of the first element and the surface of the second element are co-planar.
15. The disc drive of claim 10 wherein the surface of the first element and the surface of the second element are non-planar to each other.
16. The disc drive of claim 15 wherein the surface of the first element and the surface of the second element are parallel to each other.
17. The disc drive of claim 15 wherein the surface of the first element and the surface of the second element are orthogonal to each other.
18. The disc drive of claim 15 wherein the solder ball bridge is unsupported between the first element and the second element.
19. A method of making an electrical connection in a disc drive between a first element and a second element, comprising:
attaching a first solder ball to the first element;
attaching a second solder ball to the second element; and
creating an electrical connection between the first element and the second element through the first solder ball and the second solder ball without reflowing the first solder ball or the second solder ball.
20. The method of claim 19 further comprising:
attaching a third solder ball to the first solder ball; and
creating the electrical connection between the first element and the second element through the first solder ball, the second solder ball, and the third solder ball.