ELECTRONIC DEVICE WITH LAMINATED STRUCTURE AND MANUFACTURING METHOD THEREOF
The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates: thereby making an electronic device more firm with higher shock resistance.
1 . An electronic device with a laminated structure, comprising:
a first substrate;
a second substrate; and
a solid-state adhesive layer disposed between the first substrate and the second substrate, wherein the solid-state adhesive layer reacts with the first substrate and the second substrate to form chemically linked chains for bonding the first substrate and the second substrate.
2 . The electronic device with the laminated structure of claim 1 , wherein the chemically linked chains are formed by hydrogen bonds.
3 . The electronic device with the laminated structure of claim 1 , wherein the solid-state adhesive layer is a PVB adhesive layer.
4 . The electronic device with the laminated structure of claim 1 , wherein tensile strength of the solid-state adhesive layer is more than or equal to 200 kg/cm 2 .
5 . The electronic device with the laminated structure of claim 1 , wherein shrinking rate of the solid-state adhesive layer is less than 3%.
6 . The electronic device with the laminated structure of claim 1 , wherein the electronic device is a touch device, wherein the first substrate is a touch substrate comprising a touch inductive unit, and wherein the second substrate is a top cover substrate.
7 . The electronic device with the laminated structure of claim 6 , wherein the touch inductive unit is a capacitive touch inductive unit or a resistive touch inductive unit.
8 . The electronic device with the laminated structure of claim 1 , wherein the electronic device is a display device.
9 . A manufacturing method for an electronic device with a laminated structure, comprising the following steps of:
disposing a solid-state adhesive layer between a first substrate and a second substrate; and
forming chemically linked chains between the solid-state adhesive layer and the first substrate and between the solid-state adhesive layer and the second substrate.
10 . The manufacturing method of claim 9 , wherein the step of forming the chemically linked chains comprises a heating and a pressurizing process.
11 . The manufacturing method of claim 10 , wherein the step before the heating, and pressurizing process comprises:
fixing the first substrate and the second substrate by a fixture;
putting the fixed first substrate, the solid-state adhesive layer, and the second substrate together into a vacuum packaging bag; conducting vacuum packaging machine; and
conducting a cool-exhaust and heat-exhaust process to exclude air from spaces between the solid-state adhesive layer and the first substrate and between the solid-state adhesive layer and the second substrate.
12 . The manufacturing method of claim 10 , wherein the steps after the heating and
pressurizing process comprises:
cooling the first substrate, the solid-state adhesive layer, and the second substrate; and
removing the vacuum packaging bags.
13 . The manufacturing method of claim 10 , wherein the pressurizing and heating process is conducted in a high-pressure furnace.
14 . The manufacturing method of claim 9 , wherein the chemically linked chains are formed by hydrogen bonds.
15 . The manufacturing method of claim 9 , wherein the solid-state adhesive layer is a PVB adhesive layer.
16 . The manufacturing method of claim 9 , wherein tensile strength of the solid-state adhesive layer is more than or equal to 200 kg/cm 2 .
17 . The manufacturing method of claim 9 , wherein shrinking rate of the solid-state adhesive layer is less than 3%.
18 . The manufacturing method of claim 9 , wherein the electronic device is a display device.
19 . The manufacturing method of claim 9 , wherein the electronic device is a touch display device.