IP Library Granted Patent US 9,490,104
Granted Patent B2
US 9,490,104 · App. 13/550,638 · Granted Nov 8, 2016

Heat treatment apparatus

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Quick Facts
Patent No.
US 9,490,104
App. No.
13/550,638
Granted
Nov 8, 2016
Kind
B2
Abstract

Provided is a heat treatment apparatus that is high in thermal efficiency and can reduce surface roughness of a substrate to be treated even when a specimen is heated at 1200° C. or higher. The heat treatment apparatus heating the specimen includes a heating plate heated by plasma formed in an area of a gap to heat the specimen.

Claims (16)

1. A heat treatment apparatus, comprising:

a heating treatment chamber in which a specimen is heated;

a first plate-shaped electrode disposed in the heating treatment chamber;

a second plate-shaped electrode facing the first electrode and disposed in the heating treatment chamber;

a radio-frequency power supply configured to supply radio-frequency power to the first electrode for generating plasma between the first electrode and the second electrode;

a specimen stage facing to the second electrode and on which the specimen is placed;

a radiant heat suppressing portion configured to suppress radiant heat;

wherein the second electrode includes a disk-shaped member which shape is substantially equivalent to the first electrode and a plurality of beams disposed outside of the disk-shaped member, and is fixed to an inner wall of the heating treatment chamber with the plurality of beams extending in a radial direction of the disk-shaped member, wherein a plurality of gaps bounded by the inner wall of the heating treatment chamber and the disk-shaped member are separated by the plurality of beams,

the heating treatment chamber is divided by the second electrode into a first heating treatment part in which the first electrode is placed and a second heating treatment part in which the specimen stage is placed,

the first heating treatment part communicates with the second heating treatment part through the gaps,

the radiant heat suppressing portion comprises a first radiant heat suppressing part surrounding the first electrode and configured to suppress radiant heat radiated from the first electrode and a second radiant heat suppressing part disposed on the specimen stage and configured to suppress radiant heat radiated from the second electrode, and

a diameter of the second radiant heat suppressing part is larger than a diameter of the disk-shaped member.

2. The heat treatment apparatus according to claim 1 , wherein a base material or the surface of the radiant heat suppressing portion is tungsten, tantalum, molybdenum, tungsten carbide, tantalum carbide, or molybdenum carbide.

3. The heat treatment apparatus according to claim 1 , wherein a base material of the first electrode, a base material of the second electrode, and a base material of the specimen stage are all graphite.

4. The heat treatment apparatus according to claim 1 , further comprising a reflection mirror surrounding the first electrode, the second electrode and the specimen stage and reflecting radiant heat radiated from the first electrode and radiant heat radiated from the second electrode, wherein the reflection mirror is disposed outside of the radiant heat suppressing portion.

5. The heat treatment apparatus according to claim 4 , wherein the second electrode is in conduction with the reflection member through the beams.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2012
From: YOKOGAWA, KEN'ETSU; MIYAKE, MASATOSHI; UEMURA, TAKASHI; IZAWA, MASARU; SAKAI, SATOSHI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 028561/0187 →