Resistance change nonvolatile memory device, semiconductor device, and method of manufacturing resistance change nonvolatile memory device

1. A resistance change nonvolatile memory device, comprising:

a first wiring;

an interlayer insulating layer formed over the first wiring; and

a second wiring formed over the interlayer insulating layer,

wherein the interlayer insulating layer is interposed between the first wiring and the second wiring and includes a hole having a width not greater than a width of the first wiring,

wherein the resistance change nonvolatile memory device further comprises:

a lower electrode formed at a bottom portion of the hole and contacting the first wiring;

a resistance change layer formed over the lower electrode; and

an upper electrode formed over the resistance change layer,

wherein the lower electrode, the resistance change layer, and the upper electrode are formed inside the hole,

wherein the first wiring includes copper, while the lower electrode includes at least one metal selected from the group constituting of ruthenium, tungsten, cobalt, platinum, gold, rhodium, iridium, and palladium,

wherein the resistance change layer comprises:

a first portion formed on a top surface of the lower electrode, and

a second portion formed on a side wall of the hole, and

wherein a lower surface of the upper electrode is formed on a top surface of the first portion, and

wherein a distance between a top edge of the second portion and the lower electrode is greater than a distance between the lower surface of the upper electrode and the lower electrode.

2. The resistance change nonvolatile memory device according to claim 1 , wherein the copper has an orientation along a (111) plane, while the lower electrode contains ruthenium and the ruthenium has an orientation along a (002) plane.

3. The resistance change nonvolatile memory device according to claim 1 , wherein the lower electrode further extends from a bottom portion to a midway point of a side wall.

4. The resistance change nonvolatile memory device according to claim 1 , wherein the resistance change layer includes an oxide using a material different from a material used for the lower electrode.

5. A semiconductor device comprising:

a plurality of resistance change nonvolatile memory devices, the resistance change nonvolatile memory devices each comprising a device as claimed in claim 1 ; and

a logic circuit using the resistance change nonvolatile memory devices.

6. A resistance change nonvolatile memory device, comprising:

a first wiring;

an interlayer insulating layer formed over the first wiring; and

a second wiring formed over the interlayer insulating layer,

wherein the interlayer insulating layer is interposed between the first wiring and the second wiring and has a hole having a width not greater than a width of the first wiring,

wherein the resistance change nonvolatile memory device further comprises:

a lower electrode formed at a bottom portion of the hole while being brought into contact with the first wiring;

a resistance change layer formed over the lower electrode; and

an upper electrode formed over the resistance change layer, and

wherein the lower electrode, the resistance change layer, and the upper electrode are formed inside the hole,

wherein the resistance change layer comprises:

a first portion formed on the top surface of the lower electrode, and

a second portion formed on the side wall of the hole,

wherein a lower surface of the upper electrode is formed on a top surface of the first portion,

wherein a distance between a top edge of the second portion and the lower electrode is greater than a distance between lower surface of the upper electrode and the lower electrode, and

wherein a top edge of the second portion and a top edge of the upper electrode are brought into contact with a bottom surface of the second wiring.

7. The resistance change nonvolatile memory device according to claim 6 , wherein the first wiring includes copper and the lower electrode includes at least a metal selected from the group consisting of ruthenium, tungsten, cobalt, platinum, gold, rhodium, iridium, and palladium.

8. The resistance change nonvolatile memory device according to claim 7 , wherein the copper has an orientation along a (111) plane, while the lower electrode contains ruthenium and the ruthenium has an orientation along a (002) plane.

9. The resistance change nonvolatile memory device according to claim 6 , wherein the first wiring includes aluminum and the lower electrode contains at least one metal selected from the group consisting of tungsten, tantalum, and titanium.

10. The resistance change nonvolatile memory device according to claim 6 , wherein the first wiring includes silicon and the lower electrode contains at least one metal selected from the group consisting of tungsten, tantalum, and titanium.

11. A method of manufacturing a resistance change nonvolatile memory device, said method comprising:

forming, in an interlayer insulating layer formed over a first wiring, a hole having a width not greater than a width of the first wiring;

forming a resistance change element inside the hole; and forming a second wiring over the resistance change element so as to bring the second wiring into contact with the resistance change element,

wherein said forming said resistance change element comprises :

forming a lower electrode at a bottom portion of the hole while bringing the lower electrode into contact with the first wiring;

forming a first film for a resistance change layer over the lower electrode;

forming a second film for an upper electrode over the first film; and

removing the first film and the second film over the interlayer insulating layer and forming the resistance change layer on the lower electrode and the upper electrode on the resistance change layer in the hole,

wherein the first wiring includes copper and the lower electrode includes at least one metal selected from the group consisting of ruthenium, tungsten, cobalt, platinum, gold, rhodium, iridium, and palladium,

wherein said forming the resistance change layer comprises:

forming a first portion on the top surface of the lower electrode, and

forming a second portion on the side wall of the hole,

wherein a lower surface of the upper electrode is formed on a top surface of the first portion, and

wherein a distance between a top edge of the second portion and the lower electrode is greater than a distance between the lower surface of the upper electrode and the lower electrode.

12. The method of manufacturing a resistance change nonvolatile memory device according to claim 11 , wherein the copper has an orientation along a (111) plane, while the lower electrode contains ruthenium and the ruthenium has an orientation along a (002) plane.

13. The method of manufacturing a resistance change nonvolatile memory device according to claim 11 , wherein the resistance change layer includes an oxide using a material different from a material used for the lower electrode.

14. A method of manufacturing a resistance change nonvolatile memory device, said method comprising:

forming, in an interlayer insulating layer formed over a first wiring, a hole having a width not greater than a width of the first wiring;

forming a resistance change element inside the hole; and

forming a second wiring over the resistance change element so as to bring the second wiring into contact with the resistance change element,

wherein the forming the resistance change element comprises:

forming a lower electrode at a bottom portion of the hole while bringing the lower electrode into contact with the first wiring;

forming a first film for a resistance change layer over the lower electrode;

forming a second film for an upper electrode over the first film; and

removing the first film and the second film over the interlayer insulating layer,

wherein said forming the resistance change layer comprises:

forming a first portion on a top surface of the lower electrode, and

forming a second portion on a side wall of the hole,

wherein a lower surface of the upper electrode is formed on a top surface of the first portion,

wherein a distance between a top edge of the second portion and the lower electrode is greater than a distance between the lower surface of the upper electrode and the lower electrode, and

wherein the top edge of the second portion and a top edge of the upper electrode are brought into contact with the bottom surface of the second wiring.

15. The method of manufacturing a resistance change nonvolatile memory device according to claim 14 , wherein the forming a lower electrode comprises, inside the hole, causing a selective growth of the lower electrode over the first wiring.

16. The method of manufacturing a resistance change nonvolatile memory device according to claim 15 , wherein the first wiring includes copper and the lower electrode includes at least one metal selected from the group consisting of ruthenium, tungsten, cobalt, platinum, gold, rhodium, iridium, and palladium.

17. The method of manufacturing a resistance change nonvolatile memory device according to claim 16 , wherein the copper has an orientation along a (111) plane, while the lower electrode includes ruthenium and the ruthenium has an orientation along a (002) plane.

18. The method of manufacturing a resistance change nonvolatile memory device according to claim 15 , wherein the first wiring includes aluminum and the lower electrode includes at least one metal selected from the group consisting of tungsten, tantalum, and titanium.

19. The method of manufacturing a resistance change nonvolatile memory device according to claim 15 , wherein the first wiring includes silicon and the lower electrode includes at least one metal selected from the group consisting of tungsten, tantalum, and titanium.

20. The method of manufacturing a resistance change nonvolatile memory device according to claim 14 , wherein forming a lower electrode comprises:

forming a third film for a lower electrode so as to cover a surface of the interlayer insulating layer and an inner surface of the hole;

forming a protective film so as to cover the third film at the bottom portion of the hole and midway of a side wall;

removing a portion of the third film other than a portion covered with the protective film; and

removing the protective film.