Optical semiconductor lighting apparatus
An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed.
1. An optical semiconductor lighting apparatus comprising:
a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base;
an optical semiconductor device placed on the heat dissipation base; and
an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device,
wherein the heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed, and each of the heat dissipation fins is integrally formed with an upward extending portion which extend above an upper surface of the heat dissipation base through the air flow hole.
2. An optical semiconductor lighting apparatus comprising:
a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base;
an optical semiconductor device placed on the heat dissipation base; and
an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device,
wherein the heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed, and comprises a partition wall protruding along a circumference of the air flow hole.
3. An optical semiconductor lighting apparatus comprising:
a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base;
an optical semiconductor device placed on the heat dissipation base; and
an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device,
wherein the heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed, the optical cover is formed with an opening through which the air flow hole and the heat dissipation fins are exposed, and the heat dissipation base comprises a partition wall protruding along a circumference of the air flow hole and fitted into the opening of the optical cover.
4. An optical semiconductor lighting apparatus comprising:
a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base;
an optical semiconductor device placed on the heat dissipation base; and
an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device,
wherein the heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed, each of the heat dissipation fins is integrally formed with an upward extending portion which extend above an upper surface of the heat dissipation base through the air flow hole, the heat dissipation base comprises a partition wall protruding along a circumference of the air flow hole, and the upper extending portion of the heat dissipation fin is connected at both sides thereof to the partition wall.
5. The optical semiconductor lighting apparatus according to claim 1 , wherein the heat dissipation base comprises a circuit board mounting region around of the air flow hole, and the circuit board comprises a plurality of optical semiconductor devices mounted thereon.
6. The optical semiconductor lighting apparatus according to claim 2 , wherein the heat dissipation base comprises a circuit board mounting region around the air flow hole, and the circuit board comprises a plurality of optical semiconductor devices mounted thereon.
7. The optical semiconductor lighting apparatus according to claim 3 , wherein the heat dissipation base comprises a circuit board mounting region around the air flow hole, and the circuit board comprises a plurality of optical semiconductor devices mounted thereon.
8. The optical semiconductor lighting apparatus according to claim 4 , wherein the heat dissipation base comprises a circuit board mounting region around the air flow hole, and the circuit board comprises a plurality of optical semiconductor devices mounted thereon.
9. The optical semiconductor lighting apparatus according to claim 1 , wherein the optical cover comprises a lens portion corresponding to the optical semiconductor device.
10. The optical semiconductor lighting apparatus according to claim 2 , wherein the optical cover comprises a lens portion corresponding to the optical semiconductor device.
11. The optical semiconductor lighting apparatus according to claim 3 , wherein the optical cover comprises a lens portion corresponding to the optical semiconductor device.
12. The optical semiconductor lighting apparatus according to claim 4 , wherein the optical cover comprises a lens portion corresponding to the optical semiconductor device.
13. The optical semiconductor lighting apparatus according to claim 1 , wherein the heat dissipation base comprises male and female connectors placed on opposite sides thereof, respectfully, and at least one of the male and female connectors is connected to a female or male connector of another heat dissipation base adjacent the heat dissipation base.
14. The optical semiconductor lighting apparatus according to claim 2 , wherein the heat dissipation base comprises male and female connectors placed on opposite sides thereof, respectively, and at least one of the male and female connectors is connected to a female or male connector of another heat dissipation base adjacent the heat dissipation base.
15. The optical semiconductor lighting apparatus according to claim 3 , wherein the heat dissipation base comprises male and female connectors placed on opposite sides thereof, respectively, and at least one of the male and female connectors is connected to a female or male connector of another heat dissipation base adjacent the heat dissipation base.
16. The optical semiconductor lighting apparatus according to claim 4 , wherein the heat dissipation base comprises male and female connectors placed on opposite sides thereof, respectively, and at least one of the male and female connectors is connected to a female or male connector of another heat dissipation base adjacent the heat dissipation base.
17. The optical semiconductor lighting apparatus according to claim 1 , wherein the heat dissipation base has a width and a length, the air flow hole is longitudinally elongated at a middle of the heat dissipation base, the heat dissipation base is provided on an upper surface thereof with a pair of longitudinally elongated regions with the air flow hole interposed therebetween, and a circuit board including a plurality of optical semiconductor devices is mounted on the longitudinally elongated regions.
18. The optical semiconductor lighting apparatus according to claim 2 , wherein the heat dissipation base has a width and a length, the air flow hole is longitudinally elongated at a middle of the heat dissipation base, the heat dissipation base is provided on an upper surface thereof with a pair of longitudinally elongated regions with the air flow hole interposed therebetween, and a circuit board including a plurality of optical semiconductor devices is mounted on the longitudinally elongated regions.
19. The optical semiconductor lighting apparatus according to claim 3 , wherein the heat dissipation base has a width and a length, the air flow hole is longitudinally elongated at a middle of the heat dissipation base, the heat dissipation base is provided on an upper surface thereof with a pair of longitudinally elongated regions with the air flow hole interposed therebetween, and a circuit board including a plurality of optical semiconductor devices is mounted on the longitudinally elongated regions.
20. The optical semiconductor lighting apparatus according to claim 4 , wherein the heat dissipation base has a width and a length, the air flow hole is longitudinally elongated at a middle of the heat dissipation base, the heat dissipation base is provided on an upper surface thereof with a pair of longitudinally elongated regions with the air flow hole interposed therebetween, and a circuit board including a plurality of optical semiconductor devices is mounted on the longitudinally elongated regions.
21. The optical semiconductor lighting apparatus according to claim 4 , wherein the heat dissipation fins and the upward extending portions divide the air flow hole into a plurality of cell-type holes.