Non-lithographic line pattern formation
A metal layer is deposited over an underlying material layer. The metal layer includes an elemental metal that can be converted into a dielectric metal-containing compound by plasma oxidation and/or nitridation. A hard mask portion is formed over the metal layer. Plasma oxidation or nitridation is performed to convert physically exposed surfaces of the metal layer into the dielectric metal-containing compound. The sequence of a surface pull back of the hard mask portion, trench etching, another surface pull back, and conversion of top surfaces into the dielectric metal-containing compound are repeated to form a line pattern having a spacing that is not limited by lithographic minimum dimensions.
1. A method of forming a patterned structure comprising:
forming a metal layer on an underlying material layer;
forming a hard mask portion on said metal layer;
converting a first surface portion of said metal layer into a dielectric metal-containing compound portion employing said hard mask portion as a masking structure; and
physically exposing a top surface of a second surface portion of said metal layer by isotropically recessing physically exposed surfaces of said hard mask portion, wherein an outer periphery of said second surface portion coincides with an inner periphery of said dielectric metal-containing compound portion and an inner periphery of said second surface portion coincided with a set of bottom edges of sidewalls of a remaining portion of said hard mask portion that overlies a third surface portion of said metal layer which is laterally bounded by said second surface portion after a process that isotropically recessing physically exposed surfaces of said hard mask portion is terminated.
2. The method of claim 1 , wherein said converting of said first surface portion comprises plasma conversion of a metal in said metal layer into a dielectric metal-containing compound.
3. The method of claim 2 , wherein said plasma conversion is plasma oxidation and said dielectric metal-containing compound is an oxide of said metal in said metal layer.
4. The method of claim 2 , wherein said plasma conversion is plasma nitridation and said dielectric metal-containing compound is a nitride of said metal in said metal layer.
5. The method of claim 2 , wherein said metal is selected from aluminum, tantalum, titanium, tungsten, hafnium, zirconium, chromium, copper, zinc, iron, cobalt, and nickel.
6. A method of forming a patterned structure comprising:
forming a metal layer on an underlying material layer;
forming a hard mask portion on said metal layer;
converting a first surface portion of said metal layer into a dielectric metal-containing compound portion employing said hard mask portion as a masking structure; physically exposing a top surface of a second surface portion of said metal layer by isotropically recessing physically exposed surfaces of said hard mask portion, wherein an outer periphery of said second surface portion coincides with an inner periphery of said dielectric metal-containing compound portion; and
forming a trench through said metal layer by anisotropically etching said second surface portion and a portion of said metal layer that underlies said second surface portion employing said dielectric metal-containing compound portion and said hard mask portion as etch masks.
7. The method of claim 6 , further comprising physically exposing a top surface of a third surface portion of said metal layer by isotropically recessing physically exposed surfaces of said hard mask portion after said forming of said trench, wherein an outer periphery of said third surface portion coincides with an inner periphery of said trench.
8. The method of claim 7 , further comprising converting said third surface portion of said metal layer into a second dielectric metal-containing compound portion employing said hard mask portion as a masking structure.
9. The method of claim 8 , further comprising:
physically exposing a top surface of a fourth surface portion of said metal layer by isotropically recessing physically exposed surfaces of said hard mask portion, wherein an outer periphery of said fourth surface portion coincides with an inner periphery of said second dielectric metal-containing compound portion; and
forming another trench through said metal layer by anisotropically etching said fourth surface portion and a portion of said metal layer that underlies said fourth surface portion.
10. The method of claim 6 , further comprising performing at least once a sequence of:
physically exposing a top surface of an additional surface portion of said metal layer by isotropically recessing physically exposed surfaces of said hard mask portion;
converting said additional surface portion of said metal layer into an additional dielectric metal-containing compound portion employing said hard mask portion as a masking structure;
physically exposing a top surface of a yet additional surface portion of said metal layer by isotropically recessing physically exposed surfaces of said hard mask portion; and
forming an additional trench through said metal layer by anisotropically etching said yet additional surface portion and a portion of said metal layer that underlies said yet additional surface portion.
11. The method of claim 6 , further comprising transferring a pattern in a dielectric metal-containing compound layer including at least said dielectric metal-containing compound portion into said underlying material layer by an anisotropic etch employing said dielectric metal-containing compound layer as an etch mask.
12. The method of claim 11 , further comprising:
removing said dielectric metal-containing compound layer; and
removing remaining portions of said metal layer from above said underlying material layer.
13. The method of claim 1 , further comprising:
forming a hard mask layer comprising a material selected from silicon oxide, silicon nitride, silicon oxynitride, and a dielectric metal oxide on said metal layer; and
patterning said hard mask layer, wherein a remaining portion of said hard mask layer is said hard mask portion.
14. The method of claim 1 , further comprising forming a trench through said metal layer by anisotropically etching said second surface portion and a portion of said metal layer that underlies said second surface portion employing said dielectric metal-containing compound portion and said hard mask portion as etch masks.
15. The method of claim 14 , further comprising physically exposing a top surface of a sub-portion of said third surface portion of said metal layer by isotropically recessing physically exposed surfaces of said hard mask portion after said forming of said trench, wherein an outer periphery of said sub-portion of said third surface portion coincides with an inner periphery of said trench.
16. The method of claim 14 , further comprising transferring a pattern in a dielectric metal-containing compound layer including at least said dielectric metal-containing compound portion into said underlying material layer by an anisotropic etch employing said dielectric metal-containing compound layer as an etch mask.
17. The method of claim 6 , wherein said converting of said first surface portion comprises plasma conversion of a metal in said metal layer into a dielectric metal-containing compound.
18. The method of claim 17 , wherein said plasma conversion is plasma oxidation and said dielectric metal-containing compound is an oxide of said metal in said metal layer.
19. The method of claim 17 , wherein said plasma conversion is plasma nitridation and said dielectric metal-containing compound is a nitride of said metal in said metal layer.
20. The method of claim 17 , wherein said metal is selected from aluminum, tantalum, titanium, tungsten, hafnium, zirconium, chromium, copper, zinc, iron, cobalt, and nickel.