IP Library Patent Application 13570471
Patent Application
App. No. 13/570,471

PLASMA PROCESSING APPARATUS

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Patent No.
US None
App. No.
13/570,471
Abstract

A plasma processing apparatus which includes a plasma processing chamber for plasma-processing a sample, an induction antenna disposed outside the plasma processing chamber, a radio-frequency power supply for supplying radio-frequency power to the induction antenna, and a unit for controlling electrostatic capacity including a Faraday shield capacitively coupled with plasma and a dielectric window allowing an induction magnetic field to transmit into the plasma processing chamber is provided; electrostatic capacity between the Faraday shield and the dielectric window at a center portion and electrostatic capacity between the Faraday shield and the dielectric window at an edge portion are controlled.

Claims (28)

1 . A plasma processing apparatus comprising:

a plasma processing chamber which plasma-processes a sample;

an induction antenna disposed outside said plasma processing chamber;

a radio-frequency power supply which supplies radio-frequency power to said induction antenna; and

a unit which

comprises a Faraday shield capacitively coupled with plasma and a dielectric window which seals an upper part of said plasma processing chamber air-tightly and allows an induction magnetic field generated from said induction antenna transmit into said plasma processing chamber, and

controls electrostatic capacity between said Faraday shield and said dielectric window at a center portion and electrostatic capacity between said Faraday shield and said dielectric window at an edge portion.

2 . The plasma processing apparatus according to claim 1 , wherein a distance from said Faraday shield to said dielectric window at said center portion and a distance from said Faraday shield to said dielectric window at said edge portion are different from each other.

3 . The plasma processing apparatus according to claim 1 , wherein a thickness of said dielectric window at said center portion and a thickness of said dielectric window at said edge portion are different from each other.

4 . The plasma processing apparatus according to claim 2 , wherein said Faraday shield is a disc-like member with a step, a side of which opposing said dielectric window creates an open end, being formed on a circumference of said edge portion.

5 . The plasma processing apparatus according to claim 2 , wherein a thickness of said dielectric window at said center portion and a thickness of said dielectric window at said edge portion are different from each other.

6 . The plasma processing apparatus according to claim 4 , wherein a member comprising a dielectric material of a smaller dielectric constant than that of said dielectric window is inserted into said open end of said dielectric window.

7 . A plasma processing apparatus comprising:

a plasma processing chamber which plasma-processes a sample;

an induction antenna disposed outside said plasma processing chamber;

a radio-frequency power supply which supplies radio-frequency power to said induction antenna;

a Faraday shield capacitively coupled with plasma; and

a dielectric window which seals an upper part of said plasma processing chamber air-tightly and allows an induction magnetic field generated from said induction antenna transmit into said plasma processing chamber;

wherein a distance from said Faraday shield to said dielectric window at a center portion and a distance from said Faraday shield to said dielectric window at an edge portion are different from each other.

8 . The plasma processing apparatus according to claim 7 , wherein said Faraday shield is a disc-like member with a step, a side of which opposing said dielectric window creates an open end, being formed on a circumference of said edge portion.

9 . A plasma processing apparatus comprising:

a plasma processing chamber which plasma-processes a sample;

an induction antenna disposed outside said plasma processing chamber;

a radio-frequency power supply which supplies radio-frequency power to said induction antenna; and

a unit which controls a sheath thickness of plasma at a center portion and a sheath thickness of plasma at an edge portion.

10 . The plasma processing apparatus according to claim 9 ,

wherein said unit comprises a Faraday shield capacitively coupled with said plasma and a dielectric window which seals an upper part of said plasma processing chamber air-tightly and allows an induction magnetic field generated from said induction antenna transmit into said plasma processing chamber,

and wherein a distance from said Faraday shield to said dielectric window at said center portion and a distance from said Faraday shield to said dielectric window at said edge portion are different from each other.

Assignments (3)
CHANGE OF NAME Recorded Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052220/0045 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ORIGINAL ELECTRONIC COVER SHEET, THE ASSIGNEE'S ADDRESS IS INCORRECT, PREVIOUSLY RECORDED ON REEL 028756 FRAME 0799. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 23, 2012
From: SAKKA, YUSAKU; NISHIO, RYOJI; KAWAGUCHI, TADAYOSHI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 028840/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2012
From: SAKKA, YUSAKU; NISHIO, RYOJI; KAWAGUCHI, TADAYOSHI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 028756/0799 →