IP Library Granted Patent US 8,834,182
Granted Patent B2
US 8,834,182 · App. 13/573,967 · Granted Sep 16, 2014

Pierced flexible circuit and compression joint

Inventors: James E. Clayton (Raleigh, NC); Zakaryae Fathi (Raleigh, NC)
Assignee: Microelectronics Assembly Technologies
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,834,182
App. No.
13/573,967
Granted
Sep 16, 2014
Kind
B2
Abstract

An electrical interconnect system comprises: a flexible circuit having thereon a plurality of electrical contact pads; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the flexible circuit; a compression member to engage the contacts with the pads; and, pierced areas on said pads to enhance the mechanical engagement between the contacts and the pads.

Claims (20)

1. An electrical interconnect system comprising:

a flexible circuit having thereon a plurality of electrical contact pads;

a contact strip comprising a plurality of electrical contacts aligned with respective pads on said flexible circuit;

a compression member to engage said contacts with said pads, said compression member comprising a plurality of dimples aligned respectively with said contacts; and,

pierced areas on said pads to enhance the mechanical engagement between said contacts and said pads.

2. The system of claim 1 wherein said flexible circuit comprises a plurality of electronic components mounted on at least one surface thereof and operably connected to said contact pads.

3. The system of claim 1 wherein said contact strip comprises plated through holes on a printed circuit board.

4. The system of claim 1 wherein said contact strip comprises a plurality of electrical contacts in a mechanical connector that is operably connected to a motherboard.

5. The system of claim 1 wherein said contacts comprise plated through holes on a motherboard and said dimples are convex with a radius that is smaller than the radius of each plated through hole.

6. The system of claim 1 wherein said pierced areas comprise features selected from the group consisting of: apertures and slits.

7. A method for making an electrical interconnection comprising:

forming a flexible circuit having thereon a plurality of electrical contact pads;

piercing areas on said pads so that said areas may be more easily deformed;

aligning said flexible circuit with a contact strip having a plurality of electrical contacts corresponding to respective pads on said flexible circuit;

applying a compression member to engage said contacts with said pads so that said deformed areas enhance the mechanical engagement between said contacts and said pads, wherein said compression member comprises a plurality of dimples aligned respectively with said contacts.

8. The method of claim 7 wherein said flexible circuit comprises a plurality of electronic components mounted on at least one surface thereof and operably connected to said contact pads.

9. The method of claim 7 wherein said contact strip comprises plated through holes on a printed circuit board.

10. The method of claim 7 wherein said contact strip comprises a plurality of electrical contacts in a mechanical connector that is operably connected to a motherboard.

11. The method of claim 7 wherein said contacts comprise plated through holes on a motherboard and said dimples are convex with a radius that is smaller than the radius of each plated through hole.

12. The method of claim 7 wherein said piercing forms features selected from the group consisting of: apertures and slits.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2012
From: CLAYTON, JAMES E.; FATHI, ZAKARYAE
To: MICROELECTRONICS ASSEMBLY TECHNOLOGIES, INC
Reel/Frame 029368/0922 →
Continuity (1)
Related Publication 20140106578A1 · Apr 17, 2014