Assignment of Assignor's Interest

Recorded: 2012-11-16 Pages: 6

Assignors

CLAYTON, JAMES E.

Executed: 2012-11-05

FATHI, ZAKARYAE

Executed: 2012-11-05

Assignee

104 T.W. ALEXANDRIA DRIVE, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709

Covered Properties (10)

Thin multi-chip flex module

Patent: 8,559,181 →

Application: 12/930,971 →

Publication: US 2011/0116244

Thin multi-chip flex module

Application: 12/932,087 →

Publication: US 2011/0138617

Electronic interconnect system

Patent: 8,902,606 →

Application: 13/573,964 →

Publication: US 2014/0104766

Pierced Flexible Circuit and Compression Joint

Patent: 8,834,182 →

Application: 13/573,967 →

Publication: US 2014/0106578

Electronic module with heat spreading enclosure

Patent: 8,837,141 →

Application: 13/573,968 →

Publication: US 2014/0104786

Method for making an electrical circuit

Patent: 9,338,895 →

Application: 13/573,969 →

Publication: US 2014/0102626

Compression Connector System

Patent: 8,899,994 →

Application: 13/573,970 →

Publication: US 2014/0106579

Flexible Circuit Board and Connection System

Patent: 8,817,458 →

Application: 13/573,971 →

Publication: US 2014/0104775

Rigid circuit board with flexibly attached module

Application: 13/573,976 →

Publication: US 2014/0104776

Thin multi-chip flex module

Application: 61/009,781 →