Electronic module with heat spreading enclosure
An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.
1. An electronic module comprising:
a multilayer circuit board having a bifurcated area along one edge thereof and a plurality of electronic components mounted on at least one surface thereof;
a plurality of electrode pads functionally connected to said electronic components and positioned on the inner surfaces of said bifurcated area so that when the two legs of said bifurcated area are spread apart by about 180° said electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between said circuit board and said motherboard; and,
two metal, heat spreading covers lockably enclosing said circuit board, one on either side, said covers further providing mating surfaces upon which a mechanical clamping device can engage and secure said module to a motherboard.
2. The electronic module of claim 1 wherein said multilayer circuit board is selected from the group consisting of: flexible circuits and rigid circuit boards.
3. The electronic module of claim 1 wherein said heat spreading covers are shaped to provide an enclosed space for mounting passive devices on said circuit board.
4. The electronic module of claim 1 wherein said electronic components are selected from the group consisting of: logic devices; memory devices; buffer circuits; timing circuits; analog, digital and mixed-mode circuits; optoelectronic devices; RF devices; resistors; capacitors; inductors; and antennas.
5. The electronic module of claim 1 wherein said motherboard is part of a computing device and said multilayer flex circuit comprises a memory module.
6. The electronic module of claim 5 wherein said computing device is selected from the group consisting of: desktop computers; mobile computers; tablet computers; smart phones; and servers.
7. A method for making an electronic module comprising the steps of:
forming a multilayer circuit board having a bifurcated area along one edge thereof and a plurality of electronic components mounted on at least one surface thereof;
forming a plurality of electrode pads functionally connected to said electronic components and positioned on the inner surfaces of said bifurcated area;
reflexing each leg of said bifurcation by about 90° so that said electrode pads align with respective contacts on a motherboard; and,
enclosing said circuit board between two lockably engaging metal heat spreading covers, said covers further providing mating surfaces upon which a mechanical clamping device can engage and secure said module to a motherboard.
8. The method of claim 7 wherein said multilayer circuit board is selected from the group consisting of: flexible circuits and rigid circuit boards.
9. The method of claim 7 wherein said heat spreading covers are shaped to provide an enclosed space for mounting passive devices on said circuit board.
10. The method of claim 7 wherein said electronic components are selected from the group consisting of: logic devices; memory devices; buffer circuits; timing circuits; analog, digital and mixed-mode circuits; optoelectronic devices; RF devices; resistors; capacitors; inductors; and antennas.
11. The method of claim 7 wherein said motherboard is part of a computing device and said multilayer flex circuit comprises a memory module.
12. The method of claim 11 wherein said computing device is selected from the group consisting of: desktop computers; mobile computers; tablet computers; smart phones; and servers.