Semiconductor apparatus and method for controlling the same
A semiconductor apparatus comprises a power-up signal generation section configured to generate a power-up signal, a driver configured to drive and output the power-up signal, and a main circuit block configured to perform predetermined functions in response to an output from the driver, wherein the power-up signal generation section and an input terminal of the driver are connected by a disconnectable element.
1. A semiconductor apparatus including a chip, the chip comprising:
a power-up signal generation section configured to generate a power-up signal;
a driver configured to drive and output the power-up signal;
a main circuit block configured to perform predetermined functions in response to an output from the driver, and
a first disconnectable element which has one terminal connected to an output terminal of the power-up signal generation section, and the other terminal connected to an input terminal of the driver,
wherein the first disconnectable element puts the driver in an inactive state by being physically removed after constructing a multi-chip package,
and wherein the chip further comprises a signal transmission element configured to be connected to a master chip in the multi-chip package, and receive a power-up signal from the master chip.
2. The semiconductor apparatus according to claim 1 , wherein the chip is a slave chip in the multi-chip package.
3. The semiconductor apparatus according to claim 1 , wherein the signal transmission element is selected from the group consisting of a through-silicon via, a bonding wire and a metal line.
4. The semiconductor apparatus according to claim 1 , wherein the chip further comprises a second disconnectable element configured to be connected between an output terminal of the driver and the signal transmission element.
5. The semiconductor apparatus according to claim 4 , wherein the disconnectable element comprises a fuse or metal option.
6. A semiconductor apparatus including a multi-chip electrically coupled each other by through silicon via, each chips besides one chip of the multi-chip comprising:
a power-up signal generation section configured to generate a power-up signal; and
a disconnectable element configured to be connected between the power-up signal generation section and the through silicon via,
wherein the disconnectable element can configured to be physically removed after constructing a package.
7. The semiconductor apparatus according to claim 6 , wherein the each chips are slave chips.
8. The semiconductor apparatus according to claim 6 , wherein the each chips are configured to receive a power-up signal from the one chip after constructing the package.
9. The semiconductor apparatus according to claim 6 , wherein the disconnectable element comprises a fuse or metal option.