Phase change memory structures and methods

1. A method, comprising:

forming an insulator material on a first conductive element and on a dielectric material of a resistance variable memory cell;

forming a heater self-aligned with the first conductive element, wherein forming the heater includes modifying a portion of the insulator material by performing a process selected from the group including:

heating the portion of the insulator material; and

creating a reaction between the insulator material and a material of the first conductive element; and

forming a resistance variable material on the heater and at least a portion of the insulator material formed on the dielectric material.

2. The method of claim 1 , including forming the resistance variable material on the heater and on an unmodified portion of the insulator material.

3. The method of claim 1 , wherein heating the portion of the insulator material includes at least one of:

a rapid thermal annealing (RTA) process;

a laser annealing process; and

a microwave heating process.

4. The method of claim 1 , wherein the insulator material is aluminum nitride (AlN), the material of the first conductive element is at least one of titanium (Ti) and titanium nitride (TiN), and wherein the reaction forms a titanium aluminum nitride (TiA 1 N) heater.

5. The method of claim 1 , wherein the insulator material is silicon nitride (SiN), the material of the first conductive element is at least one of titanium nitride (TiN) and tantalum nitride (TaN), and wherein the reaction forms at least one of a titanium silicon nitride (TiSiN) heater and a tantalum silicon nitride (TaSiN) heater.

6. A method of forming a resistance variable memory structure, the method comprising:

forming an insulative adhesion material on a first electrode of a resistance variable memory cell;

forming an interfacial heater self-aligned with the first electrode by heating at least a portion of the insulative adhesion material, the interfacial heater being a material different than the insulative adhesion material;

forming a resistance variable material on the interfacial heater; and

forming a second electrode on the resistance variable material.

7. The method of claim 6 , including:

forming the first electrode by depositing an electrode material in a via formed in a dielectric material; and

performing a planarization process on the first electrode prior to forming the insulative adhesion material on the first electrode.

8. The method of claim 6 , wherein heating the at least a portion of the insulative adhesion material includes performing a microwave heating process on the at least a portion of the insulative adhesion material.

9. The method of claim 6 , wherein heating the at least a portion of the insulative adhesion material includes performing a laser annealing process on the at least a portion of the insulative adhesion material.

10. The method of claim 6 , including reducing oxidation of the first electrode by performing an in situ plasma treatment process prior to forming the insulative adhesion material on the first electrode and prior to heating the at least a portion of the insulative adhesion material.

11. A resistance variable memory structure, comprising:

a bottom electrode having a side surface in contact with a dielectric material;

a resistance variable material between the bottom electrode and a top electrode;

an insulator material having a first portion providing an adhesive interface for at least a portion of the resistance variable material; and

an interfacial heater self-aligned with the bottom electrode and positioned between the bottom electrode and the resistance variable material; wherein the interfacial heater is a modified portion of the insulator material and is a material different from the insulator material.

12. The memory structure of claim 11 , wherein the first portion of the insulator material is formed on a planarized surface of the dielectric material and the bottom electrode.

13. The memory structure of claim 11 , wherein the bottom electrode is formed in a via formed in the dielectric material, and wherein the adhesive interface provided by the first portion of the insulator material includes increased adhesion as compared to adhesion between the resistance variable material and the dielectric material.

14. The memory structure of claim 11 , wherein the self-aligned interfacial heater is formed by a reaction between the insulator material and a material of the bottom electrode.

15. The memory structure of claim 11 , wherein the insulator material has a thickness of less than about 10 nm.

16. The memory structure of claim 11 , wherein the resistance variable material comprises a phase change material.

17. A resistance variable memory cell, comprising:

an access device;

a first electrode coupled to the access device via a conductive contact;

an interfacial heater formed on, and self-aligned with, the first electrode; and

a resistance variable material formed on the self-aligned interfacial heater and on at least a portion of an insulator material formed on a dielectric material having a side surface in contact with the first electrode;

wherein the self-aligned interfacial heater is a portion of the insulator material modified via a heating process such that the self-aligned interfacial heater is a material different from the insulator material.

18. The memory cell of claim 17 , wherein the interfacial heater is configured to generate heat to assist with programming of the memory cell.

19. The memory cell of claim 17 , wherein the interfacial heater has a thermal conductivity conducive to reducing heat loss to the first electrode.

20. The memory cell of claim 17 , wherein the insulator material has a thickness of less than about 10 nm.

21. The memory cell of claim 17 , including a second electrode formed on the resistance variable material.