SYSTEM AND APPARATUS FOR MODULAR ON-DEMAND AUDIO PROCESSING, AMPLIFICATION AND DISTRIBUTION
The present disclosure relates to a system and modular unit for processing, amplification and distribution of audio signals. In an embodiment, the system comprises: one or more audio processor/amplifier units configured to be inserted into a panel or housing having one or more slots for receiving the one or more audio processor/amplifier units; wherein, the audio processor/amplifier unit includes a connector configured to connect the audio processor/amplifier unit to a power source, and to a corresponding listening zone with one or more sneakers upon insertion into one of the plurality of slots. In an embodiment, the one or more audio processor/amplifier units are sized identically to be interchangeably inserted into the plurality of slots. In another embodiment, the one or more audio processor/amplifier units are sized differently to be inserted into only certain appropriately sized ones of the plurality of slots.
1 . A modular system for processing, amplification and distribution of audio signals, comprising:
one or more audio processor/amplifier units configured to be inserted into a panel or housing having one or more slots for receiving the one or more audio processor/amplifier units;
wherein, the audio processor/amplifier unit includes a connector configured to connect the audio processor/amplifier unit to a power source, and to a corresponding listening zone upon insertion into one of the plurality of slots.
2 . The modular system of claim 1 , wherein the one or more audio processor/amplifier units are sized identically to be interchangeably inserted into the plurality of slots.
3 . The modular system of claim 1 , wherein the one or more audio processor/amplifier units are sized differently to be inserted into only certain appropriately sized ones of the plurality of slots.
4 . The modular system of claim wherein the one or more audio processor/amplifier units are configured to process received wireless audio signals for distribution to a corresponding listening one when inserted into one of the plurality of slots.
5 . The modular system of claim 1 , wherein the one or more audio processor/amplifier units are configured to amplify received audio signals for distribution to a corresponding listening zone when inserted into one of the plurality of slots.
6 . The modular system of claim 1 , wherein the one or more audio processor/amplifier units are configured to process and amplify received wireless audio signals for distribution to a corresponding listening zone when inserted into one of the plurality of slots.
7 . The modular system of claim 1 , wherein the one or more audio processor/amplifier units are configured to receive wireless audio signals for processing, amplification and distribution to a corresponding listening zone when inserted into one of the plurality of slots.
8 . The modular system of claim 1 , wherein the connector of each audio processor/amplifier unit is configured to provide a power connection, a ground connection, and one or more signal connections for the audio processor/amplifier unit.
9 . The modular system of claim 1 , wherein each of the or more audio processor/amplifier units comprises a unit body configured to enclose a printed circuit board (PCB) module, each PCB module including a connector to provide a power connection, a ground connection and one or more signal connections for onboard integrated circuits and modules.
10 . The modular system of claim 9 , wherein the unit body is further configured to allow heat from the enclosed PCB module to escape.
11 . The modular system of claim 9 , wherein the unit body is further configured to magnetically shield the enclosed PCB module from electromagnetic interference.
12 . The modular system of claim 9 , wherein the unit body comprises a number of panels or walls configured to be assembled together.
13 . The modular system of claim 12 , wherein certain panels or walls of the unit body comprise a metal alloy for transfer of heat from the PCB module to outside the unit body.
14 . The modular system of claim 12 , wherein certain panels or walls of the unit body include one or more apertures to allow eat from the PCB module to escape outside, the unit body.
15 . The modular system of claim 12 , wherein a back panel of the unit body includes an opening to allow access to a connector of the PCB module.
16 . The modular system of claim 9 , wherein the unit body is configured to receive a number of different PCB module models therein, such that the same unit body can be used for PCB module models with different specifications.
17 . A modular audio processor/amplifier unit, comprising:
a printed circuit board (PC) module configured to provide at least one of audio processing and amplification functions, and having a connecter;
a unit body configured to enclose the PCB module and allow the unit to be inserted into a panel or housing having one or more slots, at least one of the slots adapted to receive the unit;
wherein the connector is configured to connect the unit with a corresponding connector provided in at least one of the slots for access to a power source, and to corresponding listening zones associated with each slot.
18 . The modular audio processor/amplifier unit of claim 17 , wherein the connector is configured to connect the unit to a power connection, a ground connection, and one or more signal connections associated with each slot.
19 . The modular audio processor/amplifier unit of claim 17 , wherein the unit is configured to be inserted into a plurality of identically sized slots.
20 . The modular audio processor/amplifier unit of claim 17 , wherein the unit is configured to be inserted into only those slots of a plurality of slots sized to receive the unit.