Semiconductor light emitting device
View Patent ↗In one embodiment, a semiconductor light emitting device includes a stacked structure, a first electrode, a second electrode and a transparent conductive film. The stacked structure includes a first semiconductor layer with a first conductivity type, a light emitting layer and a second semiconductor layer with a second conductivity type which are formed and stacked directly or indirectly. The stacked structure is taken out light from the light emitting layer side to the second semiconductor layer side. The first electrode is connected to the first semiconductor layer. The second electrode is connected to a first principal surface of the second semiconductor layer which is exposed at the light emitting layer side. The second electrode is arranged in parallel with the first electrode. The transparent conductive film is provided so as to cover a second principal surface of the second semiconductor layer.
1. A semiconductor light emitting device, comprising:
a stacked structure including a first semiconductor layer with a first conductivity type, a light emitting layer, and a second semiconductor layer with a second conductivity type, the respective layers being stacked directly or indirectly on each other;
a first electrode connected to the first semiconductor layer;
a second electrode disposed on a first surface of the second semiconductor layer, the first surface of the second semiconductor layer being a flat surface;
a first plurality of concavo-convex shapes provided in a second surface of the second semiconductor layer, the second surface of the second semiconductor layer being opposite to the first surface of second semiconductor layer; and
a transparent conductive film having a third surface disposed on and in contact with the first plurality of concavo-convex shapes provided in the second surface of the second semiconductor layer, the transparent conductive film having a fourth surface that is opposite the third surface and a second plurality of concavo-convex shapes provided in the fourth surface, wherein
the second plurality of concavo-convex shapes corresponds to the first plurality of concavo-convex shapes, and
opposing surfaces of both the first semiconductor layer and the light emitting layer are flat surfaces.
2. The semiconductor light emitting device according to claim 1 , further comprising:
a translucent resin contacting the transparent conductive film such that the transparent conductive film is between the translucent resin and the second semiconductor layer.
3. The semiconductor light emitting device according to claim 1 , wherein the transparent conductive film comprises any one of an ITO film, a ZnO film, a Sn 2 O film, an AZO film and an IZO film.
4. The semiconductor light emitting device according to claim 1 , wherein the light emitting layer has a MQW (multiple quantum well) structure in which barrier layers and well layers are alternately provided in a stacking direction.
5. The semiconductor light emitting device according to claim 1 , wherein a clad layer having the first conductivity type and an overflow suppressing layer are between the first semiconductor layer and the light emitting layer, and a superlattice layer is between the light emitting layer and the second semiconductor layer.
6. The semiconductor light emitting device according to claim 1 , wherein the first electrode does not extend beyond the first semiconductor layer in a direction perpendicular to a stacking direction.
7. The semiconductor light emitting device according to claim 1 , wherein a film thickness of the second semiconductor layer is equal to or below 4 μm.
8. The semiconductor light emitting device according to claim 1 , wherein the first electrode and the second electrode are provided on a supporting board.
9. The semiconductor light emitting device according to claim 1 , wherein the semiconductor light emitting device is any of a GaN LED, an AlGaAs LED and an InGaAsP LED.
10. A semiconductor light emitting device, comprising:
a stacked structure including a first semiconductor layer with a first conductivity type, a light emitting layer, and a second semiconductor layer with a second conductivity type, the respective layers being stacked directly or indirectly on each other;
a first electrode connected to the first semiconductor layer;
a second electrode disposed on a first surface of the second semiconductor layer; and
a translucent conductive resin disposed on and in contact with a second surface of the second semiconductor layer which is opposite to the first surface of the second semiconductor layer, wherein
the translucent conductive resin contains a fluorescent substance,
a plurality of concavo-convex shapes is provided in the second surface of the second semiconductor layer, and
a film thickness of the second semiconductor layer is equal to or more than 2 μm, and to be equal to or lower than 4 μm.
11. The semiconductor light emitting device according to claim 10 , wherein the translucent conductive resin comprises any one of a polythiophene resin, a polyphenylene vinylene resin, a polyaniline resin and a polypyrrole resin.
12. The semiconductor light emitting device according to claim 10 , wherein the first electrode does not extend beyond the first semiconductor layer in a direction perpendicular to a stacking direction.
13. The semiconductor light emitting device according to claim 10 , wherein the first electrode and the second electrode are provided on a supporting board.
14. The semiconductor light emitting device according to claim 10 , wherein the semiconductor light emitting device is any of a GaN LED, an AlGaAs LED and an InGaAsP LED.