Three-dimensional writable printed memory
View Patent ↗The present invention discloses a three-dimensional writable printed memory (3D-wP). It comprises at least a printed memory array and a writable memory array. The printed memory array stores contents data, which are recorded with a printing means; the writable memory array stores custom data, which are recorded with a writing means. The writing means is preferably direct-write lithography. To maintain manufacturing throughput, the total amount of custom data should be less than 1% of the total amount of content data.
1. A three-dimensional writable printed memory (3D-wP), comprising:
a semiconductor substrate;
a plurality of vertically stacked memory levels stacked above and coupled to said substrate, said memory levels comprising a plurality of printed memory arrays whose patterns represent content data;
at least a writable memory array whose patterns represent custom data;
wherein the total amount of said custom data is less than 1% of the total amount of said content data.
2. The 3D-wP according to claim 1 , wherein said content data are the same for all memory devices in a same batch with said 3D-wP.
3. The 3D-wP according to claim 2 , wherein at least two memory device in said batch have different custom data.
4. The 3D-wP according to claim 1 , wherein at least a portion of said writable memory array is located below the topmost one of said memory levels.
5. The 3D-wP according to claim 4 , wherein said writable memory array is located in selected one of said memory levels.
6. The 3D-wP according to claim 4 , wherein said writable memory array is located below all of said memory levels.
7. The 3D-wP according to claim 1 , wherein the minimum feature size of the data-coding layer for said writable memory array is larger than the minimum feature size of the data-coding layer for said printed memory arrays.
8. The 3D-wP according to claim 1 , further comprising an encrypting means.
9. The 3D-wP according to claim 8 , wherein said writable memory array stores at least a key for said encrypting means.
10. The 3D-wP according to claim 8 , wherein said writable memory array stores chip ID.
11. The 3D-wP according to claim 8 , wherein said writable memory array stores the information related to the data-array sequence.