Fin-type memory

1. A method of forming a device comprising:

providing a substrate prepared with a lower electrode level with at least one bottom electrode;

forming fin stack layers on the lower electrode level, wherein the fin stack layers comprise a secondary fin body layer and a main fin body layer formed over and contacts the secondary fin body layer and the secondary fin body layer contacts the at lest one bottom electrode;

forming spacers on top of and directly contacting a top surface of the main fin body layer, wherein the spacers have a width which is less than a lithographic resolution;

patterning at least the main fin body layer using the spacers as a mask to form individual fin stacks;

removing the spacers after patterning at least the main fin body layer;

forming an interlevel dielectric (ILD) layer on the substrate, filling spaces around the fin stacks; and

forming an upper electrode level on the ILD layer after removing the spacers, the upper electrode level having at least one top electrode in contact with the fin stacks, the electrodes and fin stacks form one or more fin-type memory cells.

2. The method of claim 1 comprises forming dielectric liner lining sides of the fin stacks and top of the lower electrode level.

3. The method of claim 1 wherein forming the spacers comprises:

forming a hard mask over the fin stack layers;

patterning the hard mask; and

forming the spacers on sides of the hard mask.

4. The method of claim 3 wherein patterning at least the main fin body layer using the spacers form at least first and second fin stacks.

5. The method of claim 4 comprises forming a dielectric liner on the substrate lining sides of the fin stacks and top of the lower electrode level.

6. The method of claim 5 wherein the dielectric liner fills a space between the first and second fin stacks.

7. The method of claim 6 wherein:

the ILD layer is formed over the substrate covering the dielectric liner; and

removing excess material to provide a planar top surface between the ILD layer, liner and top of the fin stacks.

8. The method of claim 1 wherein forming the spacers comprises:

forming a hard mask over the fin stack layers;

patterning the hard mask and fin stack layers to form an initial fin stack;

forming a fill dielectric on the substrate filling spaces around the initial fin stack, the fill dielectric having a planar top surface with the top of the hard mask over the fin stack layers;

removing the hard mask to expose a top of the fin stack layers of the initial fin stack and sides of the fill dielectric;

forming the spacers on sides of the fill dielectric layer on the top of the fin stack layer.

9. The method of claim 8 wherein patterning at least the main fin body layer comprises patterning the initial fin stack using the spacers to form at least first and second fin stacks.

10. The method of claim 9 further comprises:

filling the space between the fin stacks after patterning the initial fin stack with an interfin dielectric (IFD) layer; and

removing excess material to form a planar top surface between the fill dielectric layer, top of the fin stacks and IFD layer.

11. The method of claim 9 comprises:

removing the fill dielectric layer after patterning the initial fin stack;

forming a dielectric liner lining sides of the first and second fin stacks and a top of the lower electrode layer.

12. The method of claim 11 wherein:

the ILD layer is formed on the substrate over the dielectric liner; and

excess materials are removed to form a planar surface between the ILD layer, dielectric liner and top of the fin stacks.

13. The method of claim 11 wherein the dielectric liner fills a space between the first and second fin stacks to form an interfin dielectric (IFD) layer.

14. The method of claim 13 wherein:

the ILD layer is formed on the substrate over the dielectric liner; and

excess materials are removed to form a planar surface between the ILD layer, the dielectric liner, the IFD layer and top of the fin stacks.

15. The method of claim 1 wherein the fin stack layers comprises fin stack layers of a phase change random access memory (PCRAM).

16. The method of claim 1 wherein the fin stack layers comprises fin stack layers of a resistive random access memory (RRAM).

17. The method of claim 1 wherein the memory cells are 1 fin/cell memory cells.

18. The method of claim 1 wherein the memory cell is a 2 fin/cell memory cell.

19. A method of forming a device comprising:

providing a substrate prepared with a lower electrode level with a bottom electrode;

forming layers of a fin stack on the lower electrode level, wherein the fin stack layers comprise a secondary fin body layer and a main fin body layer formed over and contacts the secondary fin body layer and the secondary fin body layer contacts the at least one bottom electrode;

forming a spacer on top of and directly contacting a top surface of main fin body layer, wherein the spacer has a width which is less than a lithographic resolution;

patterning at least the main fin body layer using the spacer as a mask to form a fin stack;

removing the spacers after patterning at least the main fin body layer;

forming an interlevel dielectric (ILD) layer on the substrate, filling spaces around the fin stack; and

forming an upper electrode level on the ILD layer after removing the spacers, the upper electrode level having a top electrode in contact with the fin stack, the electrodes and fin stack form a fin-type memory cell.

20. The method of claim 19 wherein forming the spacer comprises:

forming a hard mask over the fin stack;

patterning the hard mask and fin stack to form an initial fin stack;

forming a fill dielectric on the substrate filling spaces around the initial fin stack, the fill dielectric having a planar top surface with the top of the hard mask over the fin stack;

removing the hard mask to expose a top of the fin stack of the initial fin stack and sides of the fill dielectric; and

forming the spacer on a side of the fill dielectric layer on the top of the fin stack.

21. A method of forming a device comprising:

providing a substrate prepared with a lower electrode level with at least one bottom electrode;

forming fin stack layers on the lower electrode level, wherein the fin stack layers comprise a secondary fin body layer and a main fin body layer formed over the secondary fin body layer;

forming spacers on top of the fin stack layers, wherein the spacers have a width which is less than a lithographic resolution;

patterning at least one of the layers of the fin stack layers using the spacers as a mask to form fins, wherein the secondary fin body layer is a common secondary fin body contacting the at least one bottom electrode;

forming an interlevel dielectric (ILD) layer on the substrate, filling spaces around the fin stacks; and

forming an upper electrode level on the ILD layer, the upper electrode level having at least one top electrode in contact with the fin stacks, the electrodes and fin stacks form one or more fin-type memory cells.