Solid state lighting devices with reduced crystal lattice dislocations and associated methods of manufacturing
View Patent ↗Solid state lighting devices and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting device includes a substrate material having a substrate surface and a plurality of hemispherical grained silicon (“HSG”) structures on the substrate surface of the substrate material. The solid state lighting device also includes a semiconductor material on the substrate material, at least a portion of which is between the plurality of HSG structures.
1. A method for processing a microelectronic substrate, comprising:
forming a plurality of hemispherical grained silicon (HSG) structures on a substrate surface of a substrate material;
depositing a semiconductor material onto the substrate surface with the HSG structures, the semiconductor material including a plurality of portions separated by the HSG structures;
coalescing the separated portions of the deposited semiconductor material; and
forming a light emitting diode structure on the coalesced semiconductor material.
2. The method of claim 1 wherein forming the plurality of HSG structures includes:
depositing a polysilicon or amorphous silicon on the substrate surface of the substrate material; and
annealing the substrate material with the deposited polysilicon or amorphous silicon, thereby the plurality of HSG structures are formed.
3. The method of claim 1 wherein:
forming the plurality of HSG structures includes:
contacting the substrate surface of the substrate material with a source gas containing a silane;
seeding the substrate surface with amorphous and/or polycrystalline silicon via decomposing the silane in the source gas at a first temperature;
heating the substrate material to a second temperature higher than the first temperature; and
forming the HSG structures by decomposing additional silane from the source gas at the second temperature;
depositing the semiconductor material includes depositing at least one of aluminum nitride (AlN), aluminum gallium nitride (AlGaN), and zinc nitride (ZnN) onto the substrate material via epitaxial growth with at least one of metal-organic CVD, molecular beam epitaxy, liquid phase epitaxy, and hydride vapor phase epitaxy; and
the method further includes adjusting an operating parameter when depositing the semiconductor material such that at least a portion of the semiconductor material is grown via lateral epitaxial growth with respect to the substrate surface.
4. The method of claim 1 wherein depositing the semiconductor material includes depositing the semiconductor material onto the substrate material at least partially via lateral epitaxial growth with respect to the substrate surface.
5. The method of claim 1 wherein depositing the semiconductor material includes depositing the semiconductor material onto the substrate material via simultaneous lateral epitaxial growth and vertical epitaxial growth with respect to the substrate surface.
6. The method of claim 1 wherein depositing the semiconductor material includes depositing the semiconductor material onto the substrate material via alternate lateral epitaxial growth and vertical epitaxial growth with respect to the substrate surface.
7. The method of claim 1 wherein
forming the plurality of HSG structures includes forming a plurality of HSG structures separated from one another by a gap that exposes a portion of the substrate surface;
depositing the semiconductor material includes:
depositing the semiconductor material onto an exposed portion of the substrate material; and
growing the semiconductor material at least partially laterally in the gaps with respect to the substrate surface.
8. The method of claim 1 wherein
forming the plurality of HSG structures includes forming a plurality of HSG structures individually having a base proximate the substrate surface, an apex spaced apart from the base, and a side surface between the base and the apex, the adjacent side surfaces of the HSG structures being separated by a gap; and
depositing the semiconductor material includes:
depositing the semiconductor material onto the apexes of the HSG structures; and
growing the semiconductor material at least partially laterally into the gaps with respect to the substrate surface.
9. The method of claim 1 wherein
forming the plurality of HSG structures includes forming a plurality of HSG structures individually having a base proximate the substrate surface, an apex spaced apart from the base, and a side surface between the base and the apex, the adjacent side surfaces of the HSG structures being separated by a gap that exposes a portion of the substrate surface; and
depositing the semiconductor material includes:
depositing the semiconductor material onto the apexes of the HSG structures and the exposed portion of the substrate surface; and
growing the semiconductor material at least partially laterally in the gaps with respect to the substrate surface.
10. A method for processing a microelectronic substrate, comprising:
forming a plurality of hemispherical grained silicon (HSG) structures on a substrate surface of a substrate material;
depositing a semiconductor material onto the substrate surface with the HSG structures, the deposited semiconductor material having a threading dislocation;
growing the semiconductor material laterally in the gaps with respect to the substrate surface;
preventing the threading dislocation to propagate in the deposited semiconductor material via the lateral growth; and
forming a light emitting diode structure on the deposited semiconductor material.
11. The method of claim 10 wherein:
the HSG structures are arranged in an array having a pitch; and
the method further includes selecting the pitch of the array based on a desired dislocation density of the deposited semiconductor material.