Method for forming resist pattern and composition for forming protective film
A method for forming a resist pattern includes providing a resist film. A protective film is provided on the resist film using a composition for forming the protective film. The composition includes a polymer and an organic solvent. The resist film on which the protective film is provided is exposed to irradiation with EUV light or an electron beam. The exposed resist film is developed.
1. A method for forming a resist pattern, comprising:
providing a resist film;
providing a protective film on the resist film using a composition for forming the protective film, the composition comprising a polymer and an organic solvent;
exposing to irradiation with EUV light or an electron beam the resist film on which the protective film is provided; and
developing the exposed resist film,
wherein the polymer has a structural unit represented by formula (1) in an amount of no less than 50 mol % in the polymer:
wherein, in the formula (1), R 5 represents a hydrogen atom, a methyl group or a trifluoromethyl group; X represents a single bond, —(CO)O—or —(CO)NH—; n is an integer of to 3, and m is an integer that satisfies an expression: 1≦m≦5+2n, and
wherein the organic solvent comprises an ether solvent and a content of the ether solvent is no less than 20% by mass.
2. The method according to claim 1 , wherein the organic solvent further comprises an alcohol solvent.
3. The method according to claim 1 , wherein a greatest value of an extinction coefficient of the protective film in a range of a wavelength of no less than 150 nm and no greater than 350 nm is no less than 0.3.
4. The method according to claim 1 , wherein the polymer further comprises a structural unit represented by formula (4):
wherein, in the formula (4), R 12 represents a hydrogen atom, a methyl group, a fluorine atom or a trifluoromethyl group; and R 13 represents a linear or branched fluorinated hydrocarbon group having 1 to 10 carbon atoms or a fluorinated alicyclic hydrocarbon group having 3 to 10 carbon atoms.
5. The method according to claim 1 , wherein the polymer has the structural unit represented by formula (1) in an amount of no less than 70 mol % in the polymer.
6. The method according to claim 1 , wherein the polymer has the structural unit represented by formula (1) in an amount of no less than 90 mol % in the polymer.
7. A method for forming a resist pattern, comprising:
providing a resist film;
providing a protective film on the resist film using a composition for forming the protective film, the composition comprising polyhydroxystyrene and an organic solvent;
exposing to irradiation with EUV light or an electron beam the resist film on which the protective film is provided; and
developing the exposed resist film.
8. The method according to claim 7 , wherein the organic solvent comprises an ether solvent, an alcohol solvent, or a mixture thereof.
9. The method according to claim 8 , wherein the organic solvent comprises the ether solvent and a content of the ether solvent is no less than 20% by mass.
10. The method according to claim 7 , wherein a greatest value of an extinction coefficient of the protective film in a range of a wavelength of no less than 150 nm and no greater than 350 nm is no less than 0.3.