IP Library Granted Patent US 9,155,207
Granted Patent B2
US 9,155,207 · App. 13/606,994 · Granted Oct 6, 2015

Method for producing an anisotropic conductive film

Inventors: Masahiko Ito (Tochigi, JP); Daisuke Masuko (Tochigi, JP)
Assignee: DEXERIALS CORPORATION
H05K3/323H05K3/102H05K2203/105H05K2203/1344H05K2203/1355H05K2203/1366Y10T428/25
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Quick Facts
Patent No.
US 9,155,207
App. No.
13/606,994
Granted
Oct 6, 2015
Kind
B2
Abstract

An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 μm or less based on 10-point average.

Claims (10)

1. A method for producing an anisotropic conductive film, comprising:

simultaneously spraying conductive particles, to which electrostatic potential is applied by means of an electrostatic potential applying unit, from one spraying unit, and resin particles from another spraying unit on a processing surface so as to align the conductive particles within a resin film formed of the resin particles;

wherein the resin particles are formed of at least one insulating resin selected from an epoxy resin and an acrylic resin;

wherein the electrostatic potential of the conductive particles is in the range of 300 V to 1,500 V;

wherein the conductive particles sprayed from the spraying unit travel to the processing surface at the speed of 0.3 m/min or slower.

2. The method for producing the anisotropic conductive film according to claim 1 , wherein the spraying unit contains a nozzle.

3. The method for producing the anisotropic conductive film according to claim 1 , wherein a distance between a center of the conductive particle and a center of the adjacent conductive particle in the resin film is 1 μm to 30 μm based on 10-point average.

4. The method for producing the anisotropic conductive film according to claim 1 , wherein a distance between a center of the conductive particle in the resin film and the processing surface is 9 μm or less based on 10-point average.

5. The method for producing the anisotropic conductive film according to claim 1 , wherein the processing surface has a conductive pattern, and the conductive particles are selectively aligned on the conductive pattern.

6. The method for producing the anisotropic conductive film according to claim 2 , wherein the nozzle has a diameter of 0.1 mm to 1.0 mm.

Assignments (1)
CHANGE OF NAME Recorded Feb 8, 2013
From: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 029778/0641 →
Priority Claims (2)
JP 2007-244145 · Sep 20, 2007 · national
JP 2007-308451 · Nov 29, 2007 · national
Continuity (3)
Division 12727346 · Mar 19, 2010
Continuation PCTJP2008065686 · Sep 1, 2008
Related Publication 20120328794A1 · Dec 27, 2012