IP Library Granted Patent US 8,987,762
Granted Patent B2
US 8,987,762 · App. 13/607,480 · Granted Mar 24, 2015

Semiconductor light-emitting device and manufacturing method of the same

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Quick Facts
Patent No.
US 8,987,762
App. No.
13/607,480
Granted
Mar 24, 2015
Kind
B2
Abstract

According to one embodiment, a light-emitting unit which emits light, a wavelength conversion unit which includes a phosphor and which is provided on a main surface of the light-emitting unit, and a transparent resin which is provided on top of the wavelength conversion unit, are prepared. The transparent resin has a greater modulus of elasticity and/or a higher Shore hardness than the wavelength conversion unit.

Claims (16)

1. A semiconductor light-emitting device, comprising:

a plurality of light-emitting units which emit light and include first and second light-emitting units;

a wavelength conversion unit which includes a phosphor and which is continuously provided on light-emitting surfaces of the plurality of light-emitting units, the wavelength conversion unit including a first region disposed on the first light-emitting unit and a second region disposed on the second light-emitting unit, the first and second regions having different thicknesses; and

a transparent resin which is continuously provided on top of the wavelength conversion unit and includes a third region disposed on top of the first region and a fourth region disposed on top of the second region, the third and fourth regions having different thicknesses, wherein:

a total thickness of the first region and the third region is equal to a total thickness of the second region and the fourth region, and

the transparent resin has a Shore hardness greater than a Shore hardness of the wavelength conversion unit.

2. The semiconductor light-emitting device of claim 1 , wherein the transparent resin has a Shore hardness of more than 45.

3. The semiconductor light-emitting device of claim 1 , wherein an amount of phosphor in the first region of the wavelength conversion unit is greater than an amount of phosphor in the second region of the wavelength conversion unit.

4. The semiconductor light-emitting device of claim 1 , wherein the transparent resin has a refractive index lower than a refractive index of the wavelength conversion unit.

5. A semiconductor light-emitting device, comprising:

a plurality of light-emitting units which emit light and include first and second light-emitting units;

a phosphor-containing wavelength conversion unit continuously disposed on surfaces of the plurality of light-emitting units; and

a transparent resin which is continuously provided on top of the wavelength conversion unit, the transparent resin having a first region having a first thickness and disposed above the first light-emitting unit and a second region having a second thickness that is different from the first thickness and disposed above the second light-emitting unit, such that an upper surface of the transparent resin is even, wherein the transparent resin has a refractive index lower than a refractive index of the wavelength conversion unit.

6. The semiconductor light-emitting device of claim 5 , wherein the transparent resin has a modulus of elasticity greater than a modulus of elasticity of the wavelength conversion unit.

7. The semiconductor light-emitting device of claim 5 , wherein the transparent resin has a Shore hardness greater than a Shore hardness of the wavelength conversion unit.

8. The semiconductor light-emitting device of claim 5 , wherein the wavelength conversion unit has a third region disposed on the first light-emitting unit and a fourth region disposed on the second light-emitting unit, and a total thickness of the first region and the third region is equal to a total thickness of the second region and the fourth region.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051691/0442 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2012
From: NAKAYAMA, TOSHIYA; HIGUCHI, KAZUHITO; KOIZUMI, HIROSHI; NISHIUCHI, HIDEO; OBATA, SUSUMU; KIMURA, AKIYA; SUGIZAKI, YOSHIAKI; KOJIMA, AKIHIRO; AKIMOTO, YOSUKE
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 028924/0457 →