LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION
The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
1 - 64 . (canceled)
65 . A method for laser processing a multi-material device including a substrate and at least one target structure, the method comprising:
grouping microstructures into sets of N structures;
producing P laser pulses, combined pulses, pulse groups or pulse bursts for each set of N microstructures in a pass of a laser beam waist position over said sets of target structures, wherein P is not equal to N;
processing at least one target structure during said pass.
66 . The method of claim 65 , wherein P is less than N.
67 . The method of claim 65 , wherein N=M·P, wherein M is an integer.
68 . The method of claim 65 , wherein at least one microstructure is a member of more than one group.
69 . The method of claim 65 , wherein N=2, and P=1.
70 . The method of claim 65 , wherein N=3, and P=1.
71 . The method of claim 70 , wherein some of said microstructures are members of only one group, and some of said microstructures are members of two groups.
72 - 85 . (canceled)