Patent Assignment
Reel/Frame 056424/0287
Corrective Assignment to Correct the Application Serial Number 11776904 Previously Recorded on Reel 030582 Frame 0160. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2020-12-22
Pages: 41
Assignee
ELECTRO SCIENTIFIC INDUSTRIES, INC.
13900 NW SCIENCE PARK DRIVE, PORTLAND, OREGON, 97229-5497
Covered Properties
(172)
Method and System for High-Speed, High-Resolution, 3-D Imaging of an Object at a Vision Station
Patent:
5,024,529 →
Application:
07/150,135 →
Marking of a Workpiece by Light Energy
Patent:
5,463,200 →
Application:
08/016,262 →
Method and System for High-Speed, High-Resolution, 3-D Imaging of an Object at a Vision Station
Patent:
36,560 →
Application:
08/079,504 →
Laser System for Simultaneously Marking Multiple Parts
Patent:
5,521,628 →
Application:
08/113,977 →
Rectification of a Laser Pointing Device
Patent:
5,400,132 →
Application:
08/135,270 →
Grid Array Inspection System and Method
Patent:
5,652,658 →
Application:
08/138,776 →
Triangulation-Based 3D Imaging and Processing Method and System
Patent:
5,546,189 →
Application:
08/245,864 →
Method and System for Triangulation-Based, 3-D Imaging Utilizing an Angled Scanning Beam of Radiant Energy
Patent:
5,617,209 →
Application:
08/429,543 →
Method and System for Suppressing Unwanted Reflections in an Optical System
Patent:
6,028,671 →
Application:
08/594,696 →
Triangulation-Based 3D Imaging and Processing Method and System
Patent:
5,654,800 →
Application:
08/658,579 →
Laser Processing
Patent:
5,998,759 →
Application:
08/774,107 →
Method and System for Triangulation-Based 3-D Imaging Utilizing an Angled Scanning Beam of Radiant Energy
Patent:
5,815,275 →
Application:
08/825,108 →
Laser Beam Distributor and Compurer Program for Controlling the Same
Patent:
5,948,291 →
Application:
08/841,289 →
Multi-Color Laser Projector for Optical Layup Template and the Like
Patent:
6,000,801 →
Application:
08/850,208 →
Grid Array Inspection System and Method
Patent:
5,812,268 →
Application:
08/850,286 →
Triangulation-Based 3-D Imaging and Processing Method and System
Patent:
5,812,269 →
Application:
08/853,305 →
Method and System for High Speed Measuring of Microscopic Targets
Patent:
6,366,357 →
Application:
09/035,564 →
Versatile Method and System for High Speed, 3D Imaging of Microscopic Targets
Patent:
6,098,031 →
Application:
09/035,580 →
Pulse Control in Laser Systems
Patent:
6,339,604 →
Application:
09/096,600 →
Controlling Laser Polarization
Patent:
6,181,728 →
Application:
09/109,482 →
High-Speed Precision Positioning Apparatus
Patent:
6,144,118 →
Application:
09/156,895 →
Method and Apparatus for Orienting a Disk via Edge Contact
Patent:
5,990,650 →
Application:
09/200,365 →
Laser Processing
Patent:
6,300,590 →
Application:
09/212,974 →
Method and Apparatus for Shaping a Laser-Beam Intensity Profile by Dithering
Patent:
6,341,029 →
Application:
09/300,549 →
Programmable Illuminator for Vision System
Patent:
6,633,338 →
Application:
09/301,002 →
Method and System for High Speed Measuring of Microscopic Targets
Patent:
6,181,425 →
Application:
09/419,586 →
Method and System for High Speed Measuring of Microscopic Targets
Patent:
6,177,998 →
Application:
09/420,740 →
Method and System for High Speed Measuring of Microscopic Targets
Patent:
6,249,347 →
Application:
09/420,935 →
Laser Processing
Patent:
6,337,462 →
Application:
09/441,201 →
Energy-Efficient, Laser-Based Method and System for Processing Target Material
Patent:
6,281,471 →
Application:
09/473,926 →
Method and system for laser drilling
Application:
09/546,681 →
Laser Calibration Apparatus and Method
Patent:
6,501,061 →
Application:
09/558,367 →
System and Method for Material Processing Using Multiple Laser Beams
Patent:
6,462,306 →
Application:
09/558,368 →
Method and System for Precisely Positioning a Waist of a Material-Processing Laser Beam to Process Microstructures Within a Laser-Processing Site
Patent:
6,483,071 →
Application:
09/572,925 →
Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train
Patent:
6,340,806 →
Application:
09/585,693 →
High-Speed Precision Positioning Apparatus
Patent:
6,744,228 →
Application:
09/613,833 →
Pulse Control in Laser Systems
Patent:
6,831,936 →
Application:
09/633,837 →
Method and System for Inspecting Electronic Components Mounted on Printed Circuit Boards
Controlling Laser Polarization
Method and Subsystem for Determining a Sequence in Which Microstructures Are to Be Processed at a Laser-Processing Site
Method and Subsystem for Generating a Trajectory to Be Followed by a Motor-Driven Stage When Processing Microstructures at a Laser- Processing Site
Energy-Efficient, Laser-Based Method and System for Processing Target Material
Laser Processing
Method and System for Precisely Positioning a Waist of a Material-Processing Laser Beam to Process Microstructures Within a Laser-Processing Site
Method and Apparatus for Shaping a Laser-Beam Intensity Profile by Dithering
Controlling Laser Polarization
Laser Scanning Method and System for Marking Articles Such as Printed Circuit Boards, Integrated Circuits and the Like
Application:
10/019,522 →
Publication:
US 2003/0024913
Laser Processing
Energy-Efficient Method and System for Processing Target Material Using an Amplified, Wavelength-Shifted Pulse Train
Automated Trim Processing System
High-Speed, Precision, Laser-Based Method and System for Processing Material of One or More Targets Within a Field
Method and System for Processing One or More Microstructures of a Multi-Material Device
Methods and Systems for Precisely Relatively Positioning a Waist of a Pulsed Laser Beam and Method and System for Controlling Energy Delivered to a Target Structure
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Methods and Systems for Processing a Device, Methods and Systems for Modeling Same and the Device
Method and System for High Speed Measuring of Microscopic Targets
Method for Laser Drilling
Method and System for High Speed Measuring of Microscopic Targets
Method and System for Precisely Positioning a Waist of a Material-Processing Laser Beam to Process Microstructures Within a Laser-Processing Site
Application:
10/298,838 →
Publication:
US 2003/0116726
Method and System for High-Speed, Precise Micromachining an Array of Devices
Laser Processing
Method and System for Marking a Workpiece Such as a Semiconductor Wafer and Laser Marker for Use Therein
Application:
10/438,500 →
Publication:
US 2004/0144760
High Speed, Laser-Based Marking Method and System for Producing Machine Readable Marks on Workpieces and Semiconductor Devices with Reduced Subsurface Damage Produced Thereby
Method and System for Calibrating a Laser Processing System and Laser Marking System Utilizing Same
Method and System for Machine Vision-Based Feature Detection and Mark Verification in a Workpiece or Wafer Marking System
Method and System for Precisely Positioning a Waist of a Material-Processing Laser Beam to Process Microstructures Within a Laser-Processing Site
Application:
10/448,997 →
Publication:
US 2003/0205563
Laser Scanning Method and System for Marking Articles Such as Printed Circuit Boards, Integrated Circuits and the Like
Application:
10/617,940 →
Publication:
US 2004/0104202
Programmable illuminator for vision system
Application:
10/657,286 →
Publication:
US 2004/0047140
Laser-Based System for Memory Link Processing with Picosecond Lasers
Laser-based system for memory link processing with picosecond lasers
Application:
10/683,147 →
Publication:
US 2004/0134894
Method and subsystem for determining a sequence in which microstructures are to be processed at a laser-processing site
Application:
10/727,438 →
Publication:
US 2004/0111174
High-Speed Precision Positioning Apparatus
Laser System and Method for Material Processing with Ultra Fast Lasers
Energy-Efficient, Laser-Based Method and System for Processing Target Material
Application:
10/818,920 →
Publication:
US 2004/0188399
Laser Processing
High-Speed, Precision, Laser-Based Method and System for Processing Material of One or More Targets Within a Field
Flexible Scan Field
Drift-sensitive laser trimming of circuit elements
Application:
10/984,160 →
Publication:
US 2005/0062583
Pulse Control in Laser Systems
Laser processing
Application:
11/099,584 →
Publication:
US 2005/0173385
Method and System for High Speed Measuring of Microscopic Targets
Method and System for Precisely Positioning a Waist of a Material-Processing Laser Beam to Process Microstructures Within a Laser-Processing Site
System and Method for Inspecting Wafers in a Laser Marking System
System and method for aligning a wafer processing system in a laser marking system
Application:
11/118,456 →
Publication:
US 2006/0243711
Methods and Systems for Processing a Device, Methods and Systems for Modeling Same and the Device
Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
Application:
11/125,651 →
Publication:
US 2005/0199598
Laser processing
Application:
11/130,232 →
Publication:
US 2005/0211682
Method and System for High-Speed, Precise Micromachining an Array of Devices
Laser-based method and system for processing targeted surface material and article produced thereby
Application:
11/152,509 →
Publication:
US 2006/0000814
Pulse control in laser systems
Application:
11/178,863 →
Publication:
US 2005/0271095
Method and System for High-Speed Precise Laser Trimming, Scan Lens System for Use Therein and Electrical Device Produced Thereby
Methods and Systems for Precisely Relatively Positioning a Waist of a Pulsed Laser Beam and Method and System for Controlling Energy Delivered to a Target Structure
Method and system for calibrating a laser processing system and laser marking system utilizing same
Application:
11/266,844 →
Publication:
US 2006/0054608
Method and system for laser hard marking
Application:
11/270,108 →
Publication:
US 2006/0189091
Method and System for Laser Soft Marking
Energy-Efficient, Laser-Based Method and System for Processing Target Material
Method and Apparatus for Laser Marking by Ablation
Method and system for high-speed precise laser trimming and electrical device produced thereby
Application:
11/376,527 →
Publication:
US 2006/0199354
High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
Application:
11/405,780 →
Publication:
US 2006/0186096
High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
Application:
11/406,191 →
Publication:
US 2006/0180580
Optical Scanning Method and System and Method for Correcting Optical Aberrations Introduced into the System by a Beam Deflector
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Method and System for High-Speed, Precise Micromachining an Array of Devices
Laser processing
Application:
11/440,127 →
Publication:
US 2006/0283845
Laser-Based Method and System for Processing Targeted Surface Material and Article Produced Thereby
System and Method for Laser Processing at Non-Constant Velocities
Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
Application:
11/544,426 →
Publication:
US 2008/0316504
Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
Application:
11/544,898 →
Publication:
US 2007/0031993
Methods and Apparatus for Utilizing an Optical Reference
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Method and System for Adaptively Controlling a Laser-Based Material Processing Process and Method and System for Qualifying Same
Application:
11/606,484 →
Publication:
US 2007/0106416
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structure
Application:
11/643,746 →
Publication:
US 2008/0094640
Method and System for High-Speed Precise Laser Trimming and Scan Lens for Use Therein
Flexible Scan Field
Laser-Based Method and System for Removing One or More Target Link Structures
Hydrocyanation of 2-Pentenenitrile
Laser-based method and system for processing targeted surface material and article produced thereby
Application:
11/801,706 →
Publication:
US 2008/0073438
Energy Efficient, Laser-Based Method and System for Processing Target Material
Method and System for Laser Processing Targets of Different Types on a Workpiece
Method and System for Machine Vision-Based Feature Detection and Mark Verification in a Workpiece or Wafer Marking System
Patent:
41,924 →
Application:
11/948,425 →
System and Method for Multi-Pulse Laser Processing
Energy-Efficient, Laser-Based Method and System for Processing Target Material
Application:
11/969,264 →
Publication:
US 2008/0105664
Energy-Efficient, Laser-Based Method and System for Processing Target Material
Laser Processing of Conductive Links
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
System and Method for Automatic Laser Beam Alignment
Patent:
8,379,204 →
Application:
12/192,915 →
Link Processing with High Speed Beam Deflection
Method and System for High-Speed Precise Laser Trimming and Scan Lens for Use Therein
Method and System for High-Speed, Precise Micromachining an Array of Devices
Method and System for Laser Processing Targets of Different Types on a Workpiece
Laser-Based Method and System for Removing One or More Target Link Structures
Link Processing with High Speed Beam Deflection
Application:
12/976,539 →
Publication:
US 2011/0210105
Method and System for High-Speed, Precise Micromachining an Array of Devices
Application:
13/004,710 →
Publication:
US 2011/0108534
Laser Processing with Oriented Sub-Arrays
Application:
13/153,928 →
Publication:
US 2011/0297851
System and Method for Laser Processing at Non-Constant Velocities
Application:
13/303,327 →
Publication:
US 2012/0083049
Laser Processing of Conductive Links
Predictive Link Processing
Application:
13/404,930 →
Publication:
US 2012/0241427
Energy Efficient, Laser-Based Method and System for Processing Target Material
Application:
13/417,613 →
Publication:
US 2012/0187098
Methods and Systems for Thermal-Based Laser Processing a Multi-Material Device
Systems and Methods for Providing Temperature Stability of Acousto-Optic Beam Deflectors and Acousto-Optic Modulators During Use
Link Processing with High Speed Beam Deflection
Application:
13/608,454 →
Publication:
US 2013/0200050
Systems and Methods for Providing Polarization Compensated Multi-Spectral Laser Repair of Liquid Crystal Display Panels
Laser Calibration Apparatus and Method
Application:
60/131,138 →
System and Method for Material Processing Using Multiple Laser Beams
Application:
60/131,139 →
Method for Locating and Measuring Component Leads in Solder Paste
Application:
60/170,462 →
Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
Application:
60/178,814 →
Trajectory generation and link optimization
Application:
60/204,275 →
Method and system for severing highly conductive micro-structures
Application:
60/279,644 →
Laser based micro-machining method and system, and an application to high speed laser trimming of chip components and similar structures
Application:
60/368,421 →
Precision laser marking method and system
Application:
60/381,602 →
Laser system and method for memory link processing with ultra fast lasers
Application:
60/452,708 →
Flexible scan field
Application:
60/512,043 →
Laser marking and texturing methods and systems and articles produced thereby
Application:
60/584,268 →
Laser system and method for laser trimming
Application:
60/617,130 →
Method and system for laser soft marking
Application:
60/627,760 →
Method and system for laser hard marking
Application:
60/627,781 →
Optical scanning method and system with tilt-corrected, off-axis beam deflector
Application:
60/679,870 →
Methods and apparatus for utilizing an optical reference
Application:
60/727,607 →
Laser-based method and system for memory link processing with picosecond lasers
Application:
60/765,401 →
Laser-based repair of semiconductive substrates and process control thereof
Application:
60/810,964 →
System and method for semiconductor wafer processing
Application:
60/816,125 →
System and method for laser processing at non-constant velocities
Application:
60/832,082 →
Method and system for processing targets of different materials utilizing an easily adjustable, variable pulse width and pulse-shaped laser
Application:
60/844,822 →
System and Method for Multi-Pulse Laser Processing
Application:
60/883,583 →
Laser Processing with Narrow Bandwidth Wavelength Shifted Laser Pulses
Application:
60/938,967 →
System and Method for Automatic Laser Beam Alignment
Application:
60/956,591 →
Link processing with high speed beam deflection
Application:
60/994,404 →
Link Processing with High Speed Beam Deflection
Application:
61/291,282 →
Laser Processing with Oriented Sub-Arrays
Application:
61/352,316 →
Predictive Link Processing
Application:
61/446,943 →
Systems and Methods for Providing Temperature Stability of Acousto-Optic Beam Deflectors and Acousto-Optic Modulators During Use
Application:
61/504,563 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement (Term Loan)
Feb 1, 2019
From: ELECTRO SCIENTIFIC INDUSTRIES, INC.; MKS INSTRUMENTS, INC.; NEWPORT CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048211/0227 →
Patent Security Agreement (Abl)
Feb 1, 2019
From: ELECTRO SCIENTIFIC INDUSTRIES, INC.; MKS INSTRUMENTS, INC.; NEWPORT CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048211/0312 →
Corrective Assignment to Correct the Remove U.S. Patent No. 7,919,646 Previously Recorded on Reel 048211 Frame 0227. Assignor(S) Hereby Confirms the Patent Security Agreement (Term Loan).
Jan 14, 2021
From: ELECTRO SCIENTIFIC INDUSTRIES, INC.; MKS INSTRUMENTS, INC.; NEWPORT CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 055006/0492 →
Corrective Assignment to Correct the Remove U.S. Patent No.7,919,646 Previously Recorded on Reel 048211 Frame 0312. Assignor(S) Hereby Confirms the Patent Security Agreement (Abl).
Jan 14, 2021
From: ELECTRO SCIENTIFIC INDUSTRIES, INC.; MKS INSTRUMENTS, INC.; NEWPORT CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 055668/0687 →
Release of Security Interest
Aug 24, 2022
From: BARCLAYS BANK PLC
To: MKS INSTRUMENTS, INC.; NEWPORT CORPORATION; ELECTRO SCIENTIFIC INDUSTRIES, INC.
Reel/Frame 062739/0001 →
Release of Security Interest
Aug 24, 2022
From: BARCLAYS BANK PLC
To: MKS INSTRUMENTS, INC.; NEWPORT CORPORATION; ELECTRO SCIENTIFIC INDUSTRIES, INC.
Reel/Frame 063009/0001 →
Assignment of Assignor's Interest
Apr 24, 2024
From: SCHREURS, PETRUS N.J.
To: PIET SCHREURS HOLDING B.V.
Reel/Frame 067210/0093 →