Granted Patent B2

US 7,358,157 · App. 11/245,282 · Granted Apr 15, 2008

Abstract

Claims (25)

1. A method of high-speed, laser-based, precise laser trimming at least one electrical element having at least one measurable property, the at least one element being supported on a substrate, the method comprising:

generating a pulsed laser output having one or more laser pulses at a repetition rate, each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration; and

selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter less than about 15 microns so as to cause the one or more laser pulses having the wavelength, energy, pulse duration and the spot diameter to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element, the wavelength being short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.

2. The method as claimed in claim 1 wherein focused pulsed laser output power corresponds to about 10-50 mw with a spot diameter of less than about 15 μm, the power being scalable with reduced spot sizes less than about 15 μm such that corresponding power density is high enough to trim the element but sufficiently low to avoid microcracking.

3. The method as claimed in claim 1 wherein any microcracking obtained as a result of removing material from at least a first portion of the at least one element is insubstantial compared to microcracking obtained upon removing material from the at least one element, or from a portion of a second element, using at least one other wavelength outside the range of laser wavelengths.

4. The method as claimed in claim 1 wherein the removal of material from the at least one element creates a trim cut with a kerf width corresponding to the spot diameter.

5. The method as claimed in claim 1 wherein the step of selectively irradiating with the one or more laser pulses is carried out to at least limit formation of a heat affected zone.

6. The method as claimed in claim 1 wherein the repetition rate is at least 10 Kilohertz.

7. The method as claimed in claim 1 wherein the pulse duration of at least one laser pulse of the laser output is in the range of about 25 nanoseconds to 45 nanoseconds.

8. The method as claimed in claim 1 wherein the pulse duration of at least one laser pulse of the laser output is less than about 30 nanoseconds.

9. The method as claimed in claim 1 wherein an array of thin film electrical elements are trimmed, and wherein the method further comprises:

selectively micromachining one element in the array to vary a value of a measurable property; and

suspending the step of selectively micromachining, and while the step of selectively micromachining is suspended, selectively micromachining at least one other element in the array to vary a value of a measurable property, the method further comprising resuming the suspended step of selectively micromachining to vary a measurable property of the one element until its value is within a desired range.

10. The method as claimed in claim 9 wherein the at least one element includes a resistor and wherein the at least one measurable property is at least one of resistance and temperature.

11. The method as claimed in claim 9 further comprising suspending micromachining when a measurement of the at least one measurable property is within a predetermined range.

12. An electrical device having at least one thin film electrical element trimmed by the method of claim 1 during at least one step of producing the device.

13. A method of laser trimming at least one electrical element having a measurable property, the method comprising:

providing a laser trimmer including: a pulsed laser system, a beam delivery system, and a controller;

providing a control program which, when executed, causes the controller to control the systems to cause one or more laser output pulses of a pulsed laser output to laser trim the at least one element while avoiding microcracking with the at least one element, the pulsed laser output having a repetition rate of about 10 KHz or greater and a visible laser wavelength, the beam delivery system having an optical subsystem to produce a focused spot having a non-uniform intensity profile along a direction and having a diameter less than about 15 microns from the one or more laser output pulses, the wavelength being short enough to produce the desired short wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.

14. The method as claimed in claim 13 wherein the visible laser wavelength is in a range of about 0.5 microns to about 0.7 microns.

15. The method as claimed in claim 13 wherein the diameter is as small as about 6 microns to about 10 microns.

16. The method as claimed in claim 13 wherein an array of thin film electrical elements are trimmed, and the method further comprises:

selectively micromachining one element in the array to vary a value of a measurable property; and

suspending the step of selectively micromachining, wherein, while the step of selectively micromachining is suspended, selectively micromachining at least one other element in the array to vary a value of a measurable property, the method further comprising resuming the suspended step of selectively micromachining to vary a measurable property of the one element until its value is within a desired range.

17. An electrical device having at least one thin film electrical element trimmed by the method of claim 13 during at least one step of producing the device.

Assignments (8)