Methods and systems for processing a device, methods and systems for modeling same and the device
View Patent ↗A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
1. A system of laser processing a multi-level, multi-material device including a substrate, a microstructure and a multi-layer stack, the stack having inner layers which separate the microstructure from the substrate, the system comprising:
means for generating a pulsed laser beam having a predetermined wavelength and including at least one laser pulse having a predetermined characteristic wherein:
a) the predetermined wavelength is below an absorption edge of the substrate; and
b) wherein the at least one pulse has duration less than about 10 nanoseconds, and a repetition rate of 10 KHz or higher;
means for relatively positioning the microstructure and a waist of the laser beam in three-dimensional space based on at least a position measurement obtained at a reference location wherein the position measurement is used to obtain a prediction of a common location of the microstructure and the beam waist; and
means for irradiating the microstructure with the at least one laser pulse based on the predicted common location at a time wherein the beam waist and the microstructure substantially coincide, wherein the microstructure is cleanly removed with substantially maximum pulse energy density at the microstructure and wherein an undesirable change to the inner layers of the stack and substrate is avoided.
2. The system of claim 1 wherein the predetermined characteristic includes a q-switched pulse shape.
3. The system of claim 2 wherein the q-switched pulse shape is generated with a microlaser.
4. The system of claim 1 wherein the pulse duration of the at least one laser pulse is in the range of 1–5 nanoseconds.
5. The system of claim 1 wherein a plurality of pulses are generated and delayed by a predetermined delay based upon a physical property of a material of the multi-material device.
6. The system of claim 1 wherein the predetermined wavelength is about 1.064 microns.