IP Library Patent Application 60279644
Patent Application Provisional
App. No. 60/279,644 · Confirmation No. 4719

Method and system for severing highly conductive micro-structures

Provisional Application Expired
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Code Description Pages PDF
2021-04-19 OATH Oath or Declaration filed 41 View
2001-03-29 TRNA Transmittal of New Application 2 View
2001-03-29 SPEC Specification 51 View
2001-03-29 ABST Abstract 188 View
2001-03-29 DRW Drawings-only black and white line drawings 90 View
2001-03-29 LET. Miscellaneous Incoming Letter 2 View
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Quick Facts
App. No.
60/279,644
Filed
2001-03-29