Method for forming resist under layer film, pattern forming method and composition for resist under layer film

1. A method for forming a resist under layer film, comprising:

providing a composition for forming a resist under layer film on a substrate which is to be processed, the composition comprising a solvent and a calixarene compound or a derivative of the calixarene compound; and

heating the composition under an oxidizing atmosphere with an oxygen content of 1% or more by volume to set the composition and to form a resist under layer film.

2. The method according to claim 1 , wherein the calixarene compound or the derivative of the calixarene is represented by a general formula (2),

wherein,

each R individually represents a hydrogen atom, a substituted or unsubstituted monovalent acid dissociable group having a chain structure, or a substituted or unsubstituted monovalent thermally decomposable group having a chain structure, wherein at least one of the Rs is a substituted or unsubstituted monovalent acid dissociable group having a chain structure;

each X individually represents a substituted or unsubstituted alkylene group having 1 to 8 carbon atoms;

each Y individually represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 10 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 10 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms, or a substituted or unsubstituted phenoxy group; and

each q is individually 0 or 1.

3. The method according to claim 1 , wherein the composition further comprises, as an accelerator:

a metal compound containing at least one metal element belonging to Group 3, 4, 5, 6, 7, 8, 9, 10, 11, 13, 14, or 15 of the Periodic Table of the Elements;

a peroxide;

a diazo compound; and

a halogen component consisting of a halogen, a halogen acid, or a combination thereof.

4. The method according to claim 3 , wherein the peroxide comprises a peroxy acid, a diacyl peroxide, a peroxy acid ester, a ketal peroxide, a peroxydicarbonate, a dialkyl peroxide, a ketone peroxide, an alkyl hydroxy peroxide, or a combination thereof.

5. The method according to claim 3 , wherein the diazo compound comprises 2,2′-azobisisobutylonitrile.

6. The method according to claim 3 , wherein the metal compound comprises at least one metal compound which contains cerium, lead, silver, manganese, osmium, ruthenium, vanadium, thallium, copper, iron, bismuth, nickel, or a combination thereof.

7. The method according to claim 3 , wherein the halogen component comprises chlorine, bromine, iodine, perhalogen acid, a halogen acid, a halous acid, a hypohalous acid, a salt of the perhalogen acid, the halogen acid, the halous acid or the hypohalous acid, or a combination thereof.

8. A pattern forming method comprising:

forming a resist under layer film on a substrate using the method according to claim 1 ;

providing a resist composition solution on the resist under film to form a resist film;

exposing necessary parts of the resist film to radiation;

developing the exposed resist film to form a resist pattern; and

dry-etching the resist under layer film and the substrate using the resist pattern as a mask.