Method for manufacturing active array substrate

1. A method for manufacturing an active array substrate, the method comprising:

sequentially forming a transparent conductive layer and a first metal layer to cover a substrate;

forming a first patterned photoresist layer having a halftone portion on the first metal layer and exposing an exposed portion of the first metal layer;

removing the exposed portion of the first metal layer and a portion of the transparent conductive layer therebeneath to form a first patterned metal layer and a patterned transparent conductive layer, respectively, and removing the halftone portion of the first patterned photoresist layer to expose an exposed portion of the first patterned metal layer;

removing the exposed portion of the first patterned metal layer, and removing a remaining portion of the first patterned photoresist layer to form an intermediate structure;

sequentially forming a semiconductor layer, an insulating layer and a second metal layer to cover the intermediate structure;

forming a second patterned photoresist layer on the second metal layer, wherein an exposed portion of the second metal layer is exposed;

removing the exposed portion of the second metal layer, and a portion of the insulating layer and a portion of the semiconductor layer underlying the exposed portion of the second metal layer to form a stacked structure composed of a second patterned metal layer, a patterned insulating layer and a patterned semiconductor layer; and

heating the second patterned photoresist layer to become flowable, thereby forming a passivation layer covering the stacked structure.

2. The method of claim 1 , wherein the step of forming the first patterned photoresist layer comprises forming a first region photoresist and a second region photoresist, wherein the halftone portion is the first region photoresist, and a thickness of the first region photoresist is smaller than a thickness of the second region photoresist.

3. The method of claim 1 , wherein the step of forming the second patterned photoresist layer comprises forming a third region photoresist and a fourth region photoresist, wherein a thickness of the third region photoresist is smaller than a thickness of the fourth region photoresist.

4. The method of claim 3 , further comprising removing the third region photoresist, wherein the step of removing third region photoresist is performed in the same step with the step of removing the exposed portion of the second metal layer and the portion of the insulating layer and the portion of the semiconductor layer beneath the exposed portion of the second metal layer.

5. The method of claim 1 , wherein a portion of the patterned transparent conductive layer is not covered by the passivation layer.

6. The method of claim 1 , wherein the second patterned metal layer, each of the patterned insulating layer and the patterned semiconductor layer has a substantially identical profile.

7. A method for manufacturing an active array substrate, the method comprising:

sequentially forming a transparent conductive layer and a first metal layer to cover a substrate;

forming a first patterned photoresist layer on the first metal layer, wherein the first patterned photoresist layer comprises a first portion and a second portion, the second portion having a thick part and a thin part, and a thickness of the thick part is greater than a thickness of the thin part;

patterning the first metal layer and the transparent conductive layer therebeneath to form a first patterned metal layer and a patterned transparent conductive layer, respectively, and to form a data line connecting pad under the first portion; and removing the thin part of the second portion to expose an exposed portion of the first patterned metal layer;

removing the exposed portion of the first patterned metal layer to expose an exposed portion of the patterned transparent conductive layer, wherein the first patterned metal layer under the thick part acts as a source electrode and a drain electrode;

removing the first portion and the thick part of the second portion of the first patterned photoresist layer;

sequentially forming a semiconductor layer, an insulating layer and a second metal layer to cover the drain electrode, the source electrode, the data line connecting pad and the exposed portion of the patterned transparent conductive layer;

forming a second patterned photoresist layer on the second metal layer, wherein the second patterned photoresist layer comprises a third portion, a fourth portion and a fifth portion, the third portion having an opening exposing a portion of the second metal layer and a surrounding part surrounding the opening, the fourth portion having a medial part and a peripheral part surrounding the medial part, and a thickness of the medial part is smaller than a thickness of the peripheral part;

patterning the second metal layer, and the insulating layer and the semiconductor layer beneath the second metal layer to form a surrounding wall which is under the third portion and surrounds the data line connecting pad, a gate line connecting pad under the fourth portion and a gate electrode, a gate insulating layer and a channel layer connecting to the drain electrode and the source electrode under the fifth portion; and removing the medial part of the fourth portion to expose a portion of the gate line connecting pad; and

heating a remaining portion of the second patterned photoresist layer to become flowable, thereby forming a passivation layer covering the gate electrode, the gate insulating layer, the channel layer, the drain electrode, the source electrode, the surrounding wall and an outer edge of the gate line connecting pad.

8. The method of claim 7 , wherein the step of patterning the first metal layer comprises forming a data line, and the step of patterning the second metal layer comprises forming a gate line.

9. The method of claim 8 , wherein the second patterned photoresist layer further comprises a sixth portion located over the data line and the gate line.

10. The method of claim 7 , wherein the step of patterning the second metal layer, and the insulating layer and the semiconductor layer under the second metal layer comprises exposing a portion of the data line connecting pad.

11. The method of claim 7 , wherein the step of patterning the second metal layer, and the insulating layer and the semiconductor layer beneath the second metal layer comprises the steps of:

performing a wet etching process to etch the second metal layer; and

performing a dry etching process to etch the insulating layer and the semiconductor layer.

12. The method of claim 7 , wherein the step of heating the remaining portion of the second patterned photoresist layer comprises placing the remaining portion of the second patterned photoresist layer in an environment substantially from 200° C. to 400° C.