Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium
A method of manufacturing a semiconductor device, includes: alternately performing (i) a first step of alternately supplying a first raw material containing a first metal element and a halogen element and a second raw material containing a second metal element and carbon to a substrate by a first predetermined number of times, and (ii) a second step of supplying a nitridation raw material to the substrate, by a second predetermined number of times, wherein alternating the first and second steps forms a metal carbonitride film containing the first metal element having a predetermined thickness on the substrate.
1. A method of manufacturing a semiconductor device, comprising:
alternately performing (i) a first step of alternately supplying a first raw material containing a first metal element and a halogen element and a second raw material containing a second metal element and carbon to a substrate by a first predetermined number of times to form a metal carbide layer containing the first metal element on the substrate, and (ii) a second step of supplying a nitridation raw material to the substrate to nitride the metal carbide layer, by a second predetermined number of times, wherein alternating the first and second steps forms a metal carbonitride film containing the first metal element having a predetermined thickness on the substrate.
2. The method of claim 1 , wherein the first metal element is a transition metal element.
3. The method of claim 1 , wherein the first metal element includes at least one element selected from a group consisting of titanium, tantalum, hafnium, zirconium, molybdenum and tungsten.
4. The method of claim 1 , wherein the second metal element is a transition metal element.
5. The method of claim 1 , wherein the second metal element includes at least one element selected from a group consisting of titanium, tantalum, hafnium, zirconium, molybdenum and tungsten.
6. The method of claim 1 , wherein each of the first metal element and the second metal element is a transition metal element.
7. The method of claim 1 , wherein the second raw material includes a methyl group.
8. The method of claim 1 , wherein the second raw material includes a cyclopentadienyl group.
9. The method of claim 1 , wherein the second raw material includes a methyl group and a cyclopentadienyl group.
10. The method of claim 1 , wherein the second raw material includes an ethyl group.
11. The method of claim 1 , wherein the first step of alternately supplying the first raw material and the second raw material by the first predetermined number of times includes forming a metal carbide layer containing the first metal element on the substrate, and the second step of supplying the nitridation raw material includes forming a metal carbonitride layer containing the first metal element by nitriding the metal carbide layer.
12. The method of claim 1 , wherein the first step of alternately supplying the first raw material and the second raw material by the first predetermined number of times includes forming a metal carbide layer containing the first metal element on the substrate while discharging the halogen element contained in the first raw material and the second metal element contained in the second raw material, as a form of gas, and the second step of supplying the nitridation raw material includes forming a metal carbonitride layer containing the first metal element by nitriding the metal carbide layer.
13. The method of claim 1 , wherein the first step of alternately supplying the first raw material and the second raw material by the first predetermined number of times includes transforming and discharging the halogen element contained in the first raw material and the second metal element contained in the second raw material, as a gaseous material.
14. A method of processing a substrate, comprising:
alternately performing (i) a first step of alternately supplying a first raw material containing a first metal element and a halogen element and a second raw material containing a second metal element and carbon to a substrate by a first predetermined number of times to form a metal carbide layer containing the first metal element on the substrate, and (ii) a second step of supplying a nitridation raw material to the substrate to nitride the metal carbide layer, by a second predetermined number of times, wherein alternating the first and second steps forms a metal carbonitride film containing the first metal element having a predetermined thickness on the substrate.
15. A substrate processing apparatus comprising:
a process chamber configured to accommodate a substrate;
a first raw material supply system configured to supply a first raw material containing a first metal element and a halogen element to the substrate in the process chamber;
a second raw material supply system configured to supply a second raw material containing a second metal element and carbon to the substrate in the process chamber;
a nitridation raw material supply system configured to supply a nitridation raw material to the substrate in the process chamber; and
a control unit configured to control the first raw material supply system, the second raw material supply system and the nitridation raw material supply system so as to alternately perform (i) a first step of alternately supplying the first raw material and the second raw material to the substrate in the process chamber by a first predetermined number of times to form a metal carbide layer containing the first metal element on the substrate, and (ii) a second step of supplying the nitridation raw material to the substrate in the process chamber to nitride the metal carbide layer, by a second predetermined number of times, wherein a metal carbonitride film containing the first metal element having a predetermined thickness is formed on the substrate.
16. A non-transitory computer-readable recording medium storing a program that causes a computer to perform a process comprising:
alternately performing (i) a first step of alternately supplying a first raw material containing a first metal element and a halogen element and a second raw material containing a second metal element and carbon to a substrate in a process chamber of a substrate processing apparatus by a first predetermined number of times to form a metal carbide layer containing the first metal element on the substrate, and (ii) a second step of supplying a nitridation raw material to the substrate in the process chamber to nitride the metal carbide layer, by a second predetermined number of times, wherein alternating the first and second steps forms a metal carbonitride film containing the first metal element having a predetermined thickness on the substrate.