IP Library Granted Patent US 8,436,369
Granted Patent B2
US 8,436,369 · App. 13/617,810 · Granted May 7, 2013

Light emitting diode having electrode pads

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Quick Facts
Patent No.
US 8,436,369
App. No.
13/617,810
Granted
May 7, 2013
Kind
B2
Abstract

Exemplary embodiments of the present invention relate to a including a substrate, a first conductive type semiconductor layer arranged on the substrate, a second conductive type semiconductor layer arranged on the first conductive type semiconductor layer, an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad electrically connected to the first conductive type semiconductor layer, a second electrode pad arranged on the second conductive type semiconductor layer, an insulation layer disposed between the second conductive type semiconductor layer and the second electrode pad, and at least one upper extension electrically connected to the second electrode pad, the at least one upper extension being electrically connected to the second conductive type semiconductor layer.

Claims (41)

1. A light emitting diode, comprising:

a first type semiconductor layer;

a plurality of second type semiconductor regions arranged on the first type semiconductor layer;

a plurality of active regions, each active region disposed between the first type semiconductor layer and one second type semiconductor region of the plurality of second type semiconductor regions;

a first electrode pad electrically connected to the first type semiconductor layer;

a second electrode pad electrically connected to the plurality of second type semiconductor regions;

an insulation layer disposed between the plurality of second type semiconductor regions and the second electrode pad; and

at least one first extension electrically connected to the second electrode pad, the at least one first extension being electrically connected to one second type semiconductor region of the plurality of second type semiconductor regions.

2. The light emitting diode of claim 1 , wherein at least a portion of the second electrode pad is not arranged directly above the plurality of second type semiconductor regions.

3. The light emitting diode of claim 2 , wherein at least a portion of the second electrode pad is not arranged directly above the first type semiconductor layer.

4. The light emitting diode of claim 1 , further comprising at least one second extension electrically connected to the first electrode pad, the at least one second extension being electrically connected to the first type semiconductor layer.

5. The light emitting diode of claim 4 , wherein the at least one first extension comprises a plurality of first extensions, and the at least one second extension is substantially the same distance from each first extension of the plurality of first extensions.

6. The light emitting diode of claim 1 , further comprising a first connector connecting the at least one first extension to the second electrode pad, the insulation layer being disposed between the plurality of second type semiconductor regions and the first connector.

7. The light emitting diode of claim 1 , wherein the insulation layer covers the plurality of second type semiconductor regions, the insulation layer comprises at least one opening on the plurality of second type semiconductor regions, and the at least one first extension is electrically connected to one second type semiconductor region of the plurality of second type semiconductor regions through the at least one opening.

8. The light emitting diode of claim 1 , further comprising a plurality of transparent electrode layers forming an ohmic contact with the plurality of second type semiconductor regions, wherein the second electrode pad is arranged on an exposed region of one of the second type semiconductor regions of the plurality of second type semiconductor regions between two transparent electrode layers of the plurality of transparent electrode layers.

9. The light emitting diode of claim 8 , wherein a portion of the second electrode pad overlaps the plurality of transparent electrode layers, and the insulation layer is disposed between the overlapping portion of the second electrode pad and the plurality of transparent electrode layers.

10. A light emitting diode, comprising:

a substrate;

a first type semiconductor layer arranged on the substrate;

a plurality of second type semiconductor regions arranged on the first type semiconductor layer;

a plurality of active regions, each active region disposed between the first type semiconductor layer and one second type semiconductor region of the plurality of second type semiconductor regions;

a first electrode pad electrically connected to the first type semiconductor layer;

a second electrode pad electrically connected to the plurality of second type semiconductor regions;

an insulation layer disposed between the plurality of second type semiconductor regions and the second electrode pad; and

at least one first extension electrically connected to the second electrode pad, the at least one first extension being electrically connected to one second type semiconductor region of the plurality of second type semiconductor regions,

wherein a portion of the second electrode pad is arranged on a region of the substrate on which the first type semiconductor layer is not arranged.

11. The light emitting diode of claim 10 , further comprising at least one second extension electrically connected to the first electrode pad, the at least one second extension being electrically connected to the first type semiconductor layer.

12. The light emitting diode of claim 11 , wherein the at least one first extension comprises a plurality of first extensions, and the at least one second extension is substantially the same distance from each first extension of the plurality of first extensions.

13. The light emitting diode of claim 10 , further comprising a first connector connecting the at least one first extension to the second electrode pad, the insulation layer being disposed between the plurality of second type semiconductor regions and the first connector.

14. A light emitting diode, comprising:

a first type semiconductor layer;

a plurality of second type semiconductor regions arranged on the first type semiconductor layer;

a plurality of active regions, each active region disposed between the first type semiconductor layer and one second type semiconductor region of the plurality of second type semiconductor regions;

a first electrode pad electrically connected to the first type semiconductor layer;

a second electrode pad electrically connected to the plurality of second type semiconductor regions;

an insulation layer disposed between the plurality of second type semiconductor regions and the second electrode pad;

a plurality of first extensions electrically connected to the second electrode pad, the plurality of first extensions being electrically connected to the plurality of second type semiconductor regions; and

at least one second extension electrically connected to the first electrode pad, the at least one second extension being electrically connected to the first type semiconductor layer,

wherein the at least one second extension is substantially the same distance from each first extension of the plurality of first extensions.

15. The light emitting diode of claim 14 , wherein at least a portion of the second electrode pad is not arranged directly above the plurality of second type semiconductor regions.

16. The light emitting diode of claim 15 , wherein at least a portion of the second electrode pad is not arranged directly above the first type semiconductor layer.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2025
From: GENERAL ELECTRIC COMPANY
To: GE INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 070636/0815 →
CHANGE OF NAME Recorded Mar 26, 2025
From: GE INTELLECTUAL PROPERTY LICENSING, LLC
To: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 070643/0907 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2025
From: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
To: EDISON INNOVATIONS, LLC
Reel/Frame 070293/0273 →
CHANGE OF NAME Recorded Apr 21, 2014
From: SEOUL OPTO DEVICE CO., LTD
To: SEOUL VIOSYS CO., LTD
Reel/Frame 032723/0126 →