Semiconductor device and method for forming the same
View Patent ↗Semiconductor devices and methods of forming the same are provided. The semiconductor device may include a semiconductor element disposed on a substrate and including an insulating layer and a gate electrode, a doped region having a first conductivity-type on the substrate, a conductive interconnection electrically connected to the gate electrode, and a first contact plug having a second conductivity-type and electrically connecting the conductive interconnection and the doped region to each other and constituting a Zener diode by junction with the doped region.
1. A semiconductor device comprising:
a semiconductor element on a substrate, the semiconductor element including an insulating layer and a gate electrode;
a doped region having a first conductivity-type on the substrate;
a conductive interconnection electrically connected to the gate electrode; and
a first contact plug having a second conductivity-type, the first contact plug electrically connecting the conductive interconnection and the doped region to each other and constituting a Zener diode at a junction with the doped region.
2. The semiconductor device as set forth in claim 1 , wherein the first conductivity-type is high-concentration P-type, and the second conductivity-type is high-concentration N-type.
3. The semiconductor device as set forth in claim 1 , further comprising:
a second contact plug connecting the gate electrode and the conductive interconnection to each other.
4. The semiconductor device as set forth in claim 3 , wherein the first and second contact plugs are formed in a same process for forming a plug.
5. The semiconductor device as set forth in claim 1 , wherein the doped region is in a first region, the first region being apart from a second region in which the semiconductor element is formed.
6. The semiconductor device as set forth in claim 1 , wherein the doped region has substantially a same concentration as a source/drain of the semiconductor element.
7. The semiconductor device as set forth in claim 1 , wherein doping concentrations of the first contact plug and the doped region are such that a breakdown voltage of the Zener diode is in the range of about 3.5 to 10 volt.
8. The semiconductor device as set forth in claim 1 , wherein a junction surface of the Zener diode is determined by a cross-sectional area of the first contact plug.
9. A semiconductor device comprising:
a semiconductor element on a substrate;
a doped region on the substrate, the doped region having a first conductivity-type; and
a doped element projecting from the substrate, the doped element having a second conductivity-type, and the doped element contacting the doped region to form a Zener diode and electrically connected to the semiconductor element, wherein the doped element is connected to a gate electrode of the semiconductor element.
10. The semiconductor device as set forth in claim 9 , wherein the first conductivity-type is P-type, and the second conductivity-type is N-type.
11. The semiconductor device as set forth in claim 9 , wherein doping concentrations of the doped element and the doped region are such that a breakdown voltage of the Zener diode is in the range of about 3.5 to 10 volt.
12. The semiconductor device as set forth in claim 9 , further comprising:
a conductive line between the semiconductor element and the doped element.
13. The semiconductor device as set forth in claim 12 , wherein the conductive line includes at least one metal line.
14. The semiconductor device as set forth in claim 9 , wherein the doped element is a contact plug.
15. The semiconductor device as set forth in claim 9 , wherein the first conductivity-type is one of high-concentration P-type and high-concentration N-type, and the second conductivity-type is the other one of high-concentration P-type and high-concentration N-type.