Selective masking by photolithography (SMP) for making electrochemical measurements

1. A method for isolating microstructural regions or features on a surface for electrochemical experimentation consisting of:

providing a metal sample;

coating the metal sample with a photoresist;

selecting a region of interest on the metal sample;

exposing the region of interest with light and creating exposed photoresist and unexposed photoresist with direct modulation of the light distribution itself by optoelectronic devices such as spatial light modulators or digital micromirror devices; and

immersing the metal sample in a developer solution and removing the exposed photoresist and creating a developed region of unexposed photoresist.

2. The method for isolating microstructural regions of claim 1 further including the step of revealing the bare metal surface of the region of interest while protecting the developed region of unexposed photoresist.

3. The method for isolating microstructural regions of claim 2 further including the steps of hard-baking the metal sample and improving the coating reliability and adhesion and electrically isolating the developed region of unexposed photoresist.

4. The method for isolating microstructural regions of claim 3 further including the steps of polishing the metal sample prior to coating the metal sample with a photoresist and placing a grid reference mark on the metal sample prior to the step of selecting a region of interest of the metal sample.

5. The method for isolating microstructural regions of claim 4 wherein the step of placing a grid reference mark is by laser machining.

6. The method for isolating microstructural regions of claim 5 further including the steps of placing a water-resistant adhesive strip with a first perforated window over the region of interest and sealing a waterproof container with a second larger perforated window over the first perforated window and conducting electrochemical measurements.

7. The method for isolating microstructural regions of claim 3 utilizing a 1 μm-thick layer of photoresist via spin-coating onto the metal sample.

8. The method for isolating microstructural regions of claim 7 further including the step of soft-baking at 110° C. for about 1-2 minutes on a hot plate.

9. The method for isolating microstructural regions of claim 8 wherein the light is UV laser light and utilizing a laser energy of about 2.6 μJ corresponding to a fluence of about 200 mJ/cm 2 .

10. The method for isolating microstructural regions of claim 9 utilizing a UV laser light that is a 355 nm solid state laser with maximum pulse energies of about 300 μJ and pulsewidths of about 30 ns.

11. The method for isolating microstructural regions of claim 3 utilizing a hard-baking step at a temperature of about 150° C. for about 60 minutes.

12. The method for isolating microstructural regions of claim 1 wherein the light can be pulsed or continuous.

13. The method for isolating microstructural regions of claim 2 wherein the light is UV laser light.

14. A method for isolating microstructural regions or features on a surface for electrochemical experimentation consisting of:

providing a metal sample;

coating the metal sample with a negative photoresist and thereby isolating the metal sample;

selecting regions of interest on the metal sample;

exposing the regions of interest with light energy and creating regions of exposed negative photoresist and regions of unexposed negative photoresist via utilizing a laser energy of about 2.6 microJoules corresponding to a fluence of about 200 mJ/cm 2 and a UV laser light that is a 355 nm solid state laser with maximum pulse energies of about 300 μJ and pulsewidths of about 30 ns with direct modulation of the light distribution itself by optoelectronic devices such as spatial light modulators or digital micromirror devices;

immersing the metal sample in a developer solution and removing the regions of unexposed negative photoresist and creating developed regions of remaining photoresist and revealing bare steel surface of the regions of interest while protecting the regions of exposed negative photoresist; and

hard-baking the metal sample and improving the coating reliability and adhesion and electrically isolating the developed regions of remaining negative photoresist.