Multilayer ceramic electronic component and fabrication method thereof
There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T 1 , 0.8≦|T 1 /Tc|≦1.0 is satisfied.
1. A multilayer ceramic electronic component comprising:
a ceramic main body;
a plurality of internal electrodes laminated within the ceramic main body;
external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes at opposing side surfaces of the ceramic main body extending along a thickness direction in which the internal electrodes are laminated, the external electrodes extending along the entire opposing side surfaces in the thickness direction and a portion of opposing upper and lower surfaces at the ends of the ceramic main body in the thickness direction; and
plating layers disposed on outer surfaces of the external electrodes,
wherein the external electrodes comprise a same material disposed on the opposing side surfaces and the opposing upper and lower surfaces,
the external electrodes have an average thickness of 10 μm or less, and
when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction in which the internal electrodes are laminated to contribute to capacitance formation by a distance equal to 25% of a thickness of the capacitance formation region of the ceramic main body is T 1 , 0.8≦|T 1 /Tc|<1.0 is satisfied;
wherein when the thinnest point of the external electrodes at edge portions of the ceramic main body is T 3 , 0.2<|T 3 /Tc|<1.0 is satisfied; and
when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at an outermost internal electrode of the ceramic main body in which the internal electrodes are laminated to contribute to capacitance formation is T 2 , 0.5≦|T 2 /Tc|<1.0 is satisfied.
2. The multilayer ceramic electronic component of claim 1 , wherein the external electrodes include 60 wt % or less of a conductive metal with regard to overall weight.
3. The multilayer ceramic electronic component of claim 2 , wherein the conductive metal is one or more selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).