IP Library Granted Patent US 9,142,273
Granted Patent B2
US 9,142,273 · App. 13/623,329 · Granted Sep 22, 2015

Semiconductor memory device

Inventor: Atsushi Kawasumi (Kawasaki, JP)
Assignee: KABUSHIKI KAISHA TOSHIBA
G11C7/227G11C11/419G11C11/412
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Quick Facts
Patent No.
US 9,142,273
App. No.
13/623,329
Granted
Sep 22, 2015
Kind
B2
Abstract

According to one embodiment, a semiconductor memory device includes a memory cell array including memory cells, word lines connected to the memory cell array to select rows of the memory cell array, first bit lines connected to the memory cell array to select columns of the memory cell array, a replica cell array including replica cells respectively connected to the word lines, and storing information on characteristics of the rows of the memory cell array, and a second bit line connected to the replica cells. An operation is changed for each row of the memory cell array based on the information in the replica cells.

Claims (50)

1. A semiconductor memory device comprising:

a memory cell array including memory cells;

word lines connected to the memory cell array to select rows of the memory cell array;

first bit lines connected to the memory cell array to select columns of the memory cell array;

a replica cell array including replica cells respectively connected to the word lines, and storing information on characteristics of the rows of the memory cell array; and

a second bit line connected to the replica cells,

wherein an operation is changed for each row of the memory cell array based on the information in the replica cells.

2. The device of claim 1 , wherein the information to be stored in the replica cells is information for controlling a cell current.

3. The device of claim 1 , wherein

the replica cell array includes columns equal in number to column addresses, and

replica cells in a column corresponding to a column address are used in a read.

4. The device of claim 3 , wherein

the memory cell array includes groups,

each of the groups includes columns equal in number to the column addresses, and

data is read from a memory cell in a column corresponding to a column address in a read.

5. The device of claim 1 , further comprising:

a logic gate configured to perform a logic operation on data read from the memory cell array to the first bit lines; and

a write circuit configured to write data to the replica cells based on an output from the logic gate.

6. The device of claim 1 , further comprising a power supply circuit configured to supply power to the memory cell array, and to change the level of the power in accordance with a voltage of the second bit line.

7. The device of claim 1 , further comprising:

a row decoder connected to the word lines; and

a power supply circuit configured to supply power to the row decoder,

wherein the power supply circuit changes the level of the power in accordance with a voltage of the second bit line.

8. The device of claim 1 , wherein the replica cell has the same arrangement as that of the memory cell.

9. The device of claim 1 , wherein the memory cell comprises an SRAM cell.

10. A semiconductor memory device comprising:

a memory cell array including memory cells;

word lines connected to the memory cell array to select rows of the memory cell array;

first bit lines connected to the memory cell array to select columns of the memory cell array;

a replica cell array including first replica cells respectively connected to the word lines, and storing information on operating speeds of the rows of the memory cell array;

a second bit line connected to the first replica cells;

a second replica cell having fixed data;

a replica bit line connected to the second replica cell and the second bit line; and

sense amplifiers respectively connected to the first bit lines, and configured to be activated based on a voltage of the replica bit line.

11. The device of claim 10 , wherein

the replica cell array includes columns equal in number to column addresses, and

first replica cells in a column corresponding to a column address is used in a read.

12. The device of claim 11 , wherein

the memory cell array includes groups,

each of the groups includes columns equal in number to the column addresses, and

data is read from a memory cell in a column corresponding to a column address in a read.

13. The device of claim 10 , further comprising:

a logic gate configured to perform a logic operation on data read from the memory cell array to the first bit lines; and

a write circuit configured to write data to the first replica cells based on an output from the logic gate.

14. The device of claim 10 , further comprising a row decoder connected to the word lines,

wherein the row decoder negates a word line based on a voltage of the replica bit line.

15. The device of claim 10 , further comprising a replica word line connected to the second replica cell,

wherein the replica word line is asserted simultaneously with a selected word line in a read.

16. The device of claim 10 , wherein the first replica cell has the same arrangement as that of the memory cell.

17. The device of claim 10 , wherein the memory cell comprises an SRAM cell.

Assignments (4)
MERGER Recorded Jan 31, 2020
From: TOSHIBA MEMORY CORPORATION; K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051679/0042 →
DE-MERGER Recorded Jan 31, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051762/0119 →
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2020
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 051762/0197 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2012
From: KAWASUMI, ATSUSHI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 029499/0935 →
Priority Claims (1)
JP 2012-064455 · Mar 21, 2012 · national
Continuity (1)
Related Publication 20130250659A1 · Sep 26, 2013