Method and system for endpoint detection
A process control system is provided for use with a processing tool for thin film patterning by a material removal processing system. The system includes an optical end-point detector operable within a working area defined by the processing tool when the processing tool is applied to an article, the optical end-point detector performing in-situ measurements of parameters of patterned thin film on the article. An optical integrated monitoring tool is installed with the processing tool and operable outside the working area for measuring parameters of the patterned thin film on the article. A control unit is connected to the end-point detector and to the integrated monitoring tool, and includes processing and computational intelligence responsive to data received from the end-point detector and to the measured data received from the integrated monitoring tool for analyzing data and generating a signal for terminating the patterning of the thin film on the article.
1. A process control system for use with a processing tool for a material deposition which is to be sequentially applied to a stream of substantially identical patterned articles, the system comprising:
an optical end-point detector operable within a working area defined by the processing tool when said processing tool is applied to an article, the optical end-point detector being configured and operable for performing in-situ measurements of one or more parameters of at least a layer of said material being deposited on the patterned article and generating measured data indicative thereof;
an optical monitoring tool integrated with the processing tool and operable outside said working area, wherein the optical monitoring unit includes a measurement unit with an optical assembly configured and operable for measuring one or more parameters of at least said one layer and generating data indicative thereof;
a control unit connected to the end-point detector and to the integrated monitoring tool, the control unit comprising processing and computational intelligence which is responsive to the data generated by the end-point detector and responsive to the measured data generated by the integrated monitoring tool and is configured for analyzing these data and generating a control signal for terminating the deposition of said layer on the article; and
at least one additional end-point detector connectable to the control unit.
2. The system according to claim 1 , wherein said end-point detector utilizes broad-band light source.
3. The system according to claim 1 , wherein said stream of the articles are semiconductor wafers.
4. The system according to claim 1 , wherein said integrated monitoring tool is capable of spectrophotometric measurements.
5. The system according to claim 1 , wherein said material deposition processing is Chemical Vapor Deposition (CVD).
6. The system according to claim 2 , wherein said end-point detector is capable of spectrophotometric measurements.
7. The system according to claim 4 , wherein said end-point detector is capable of spectrophotometric measurements.
8. The system according to claim 4 , wherein said control unit is a part of said integrated monitoring tool.
9. The system according to claim 4 , wherein said end-point detector includes an optical fiber.
10. The system according to claim 1 , wherein said integrated monitoring tool includes normal incidence optics.
11. The system according to claim 4 , wherein said integrated monitoring tool includes normal incidence optics.
12. The system according to claim 7 , wherein said integrated monitoring tool includes normal incidence optics.
13. The system according to claim 1 , wherein said control unit supports a communication protocol with a control unit of the processing tool.
14. The system according to claim 1 , wherein said control unit is connectable via a communication line to a control unit of the processing tool.
15. The system according to claim 1 , wherein said at least one additional end-point detector is a non-optical detector.
16. The system according to claim 1 , wherein said end-point detector utilizes a narrow-band light source.
17. The system according to claim 1 , wherein said end-point detector utilizes a laser light source.