Substrate processing apparatus and substrate processing method

1. A substrate processing apparatus comprising:

a substrate holder which holds a substrate having a pattern formed in a surface of the substrate in a predetermined positional relationship with a reference indicator of the substrate;

a cleaner which abuts an adhesive member on the surface of the substrate which is held by the substrate holder and peels off the adhesive member along the surface of the substrate in a peeling direction which is not at right angle to a direction of the pattern, thereby cleaning the surface of the substrate;

a detection section which detects the reference indicator; and

a controller which executes at least one of change of the peeling direction of the adhesive member and rotation of the substrate based upon a direction of the pattern at the time of detection of the reference indicator by the detection section, thereby adjusting the angle of the peeling direction of the adhesive member with respect to the direction of the pattern.

2. The substrate processing apparatus of claim 1 , wherein an angle of the peeling direction with respect to the direction of the pattern is 70 degrees or smaller.

3. The substrate processing apparatus of claim 1 , wherein the detection section detects the reference indicator in a condition that the substrate holder holds the substrate.

4. The substrate processing apparatus of claim 3 , further comprising a rotator which rotates the substrate holder,

wherein the cleaner fixes the peeling direction of the adhesive member, and

the controller controls the rotator so that the substrate held by the substrate holder rotates and the angle of the peeling direction of the adhesive member with respect to the direction of the pattern is adjusted.

5. The substrate processing apparatus of claim 3 , wherein the cleaner is capable of freely changing the peeling direction of the adhesive member, and

the controller controls the cleaner so that the peeling direction of the adhesive member is changed and the angle of the peeling direction of the adhesive member with respect to the direction of the pattern is adjusted.

6. The substrate processing apparatus of claim 1 , further comprising a substrate transporter which transports the substrate to the substrate holder from the detection section.

7. The substrate processing apparatus of claim 6 , wherein the detection section comprises a rotary holder which holds and rotates the substrate and a detector which detects the reference indicator of the substrate held by the rotary holder, and

prior to transportation of the substrate to the substrate holder by the substrate transporter, the controller controls the rotary holder so that the substrate held by the rotary holder rotates and the angle of the peeling direction of the adhesive member with respect to the direction of the pattern is adjusted.

8. The substrate processing apparatus of claim 1 , wherein the pattern has lines and spaces.

9. The substrate processing apparatus of claim 8 , wherein the direction of the pattern is a direction of elongation of the pattern.

10. The substrate processing apparatus of claim 1 , wherein the cleaner comprises a supply part which feeds the adhesive member, a collection part which winds up the adhesive member, a roller which abuts the adhesive member on the surface of the substrate, and a main unit,

the supply part and the collection part are inside the main unit, and

the roller protrudes toward a direction below the bottom surface of the main unit.

11. The substrate processing apparatus of claim 10 , wherein the detection section is disposed at the side surface of the main unit.

12. A substrate processing method comprising the steps of:

holding a substrate which has a pattern formed in a surface of the substrate in a predetermined positional relationship with a reference indicator of the substrate by a substrate holder;

abutting an adhesive member of a cleaner on the surface of the substrate held by the substrate holder;

peeling the adhesive member along the surface of the substrate in a peeling direction which is not at right angle to a direction of the pattern, thereby cleaning the surface of the substrate;

detecting the reference indicator with a detection section; and

executing with a controller at least one of change of the peeling direction of the adhesive member and rotation of the substrate based upon the direction of the pattern at the time of detection of the reference indicator by the detection section, thereby adjusting the angle of the peeling direction of the adhesive member with respect to the direction of the pattern.