Adjustable heat pipe thermal unit
Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.
1. An assembly comprising:
a substrate including a first die structure and a second die structure positioned thereon;
a first plate;
a second plate positioned on the first die structure, the second plate positioned between the first plate and the first die structure;
a third plate positioned on the second die structure, the third plate positioned between the second die structure and the first plate; and
an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being substantially C-shaped, the adjustable heat pipe being in thermal contact with the first plate and the second plate.
2. The assembly of claim 1 , further comprising a plurality of springs positioned between the first plate and the second plate.
3. The assembly of claim 1 , wherein the adjustable heat pipe comprises a tubular structure.
4. The assembly of claim 1 , wherein the adjustable heat pipe defines a distance between the first plate and the second plate, and wherein the distance is adjustable in a range of up to 1 mm.
5. The assembly of claim 1 , wherein the adjustable heat pipe is attached to the first plate and attached to the second plate.
6. The assembly of claim 2 , wherein the second plate is rectangular in shape and includes a first surface facing the first plate, the first surface including four corner regions. the plurality of springs includes a spring positioned in each corner region.
7. The assembly of claim 1 , wherein the adjustable heat pipe is adapted to transfer heat from the second plate to the first plate.
8. The assembly of claim 1 , further comprising a thermal interface material positioned between the first die structure and the second plate.
9. The assembly of claim 1 , wherein the third plate has a height that is greater than that of the second plate.
10. The assembly of claim 1 , wherein the second die structure has a height that is greater than that of the first die structure, and wherein a distance between the first plate and the second plate is greater than a distance between the first plate and the third plate.
11. An assembly comprising:
a substrate including first and second die structures thereon;
a first plate spaced apart from the substrate and the first and second die structures;
a second plate positioned between the first die structure and the first plate;
a third plate positioned between the second die structure and the first plate;
a first heat pipe positioned between the first plate the second plate;
a second heat pipe positioned between the first plate and the third plate;
a first thermal interface material layer positioned between the first die structure and the second plate;
a second thermal interface material layer positioned between the second die structure and the third plate;
a first plurality of springs positioned between the first plate and the second plate;
a second plurality of springs positioned between the first plate and the third plate; and
the first plate configured to extend over an entire width of the second plate and the third plate.
12. The assembly of claim 11 , further comprising a third heat pipe positioned between the first plate and the second plate.
13. The assembly of claim 11 , wherein the first heat pipe and the second heat pipe are each substantially C-shaped.
14. The assembly of claim 11 , wherein the first heat pipe comprises a tubular structure, and wherein the first heat pipe defines a distance between the first plate and the second plate, and wherein the distance is adjustable in a range of up to 1 mm.
15. An assembly comprising:
a substrate including first and second die structures positioned thereon;
a first plate;
a second plate positioned on the first die structure, the second plate positioned between the first plate and the first die structure;
an adjustable heat pipe positioned between the first plate and the second plate; and
a third plate positioned on the second die structure, the third plate positioned between the first plate and the second die structure, the third plate having a height that is greater than that of the second plate, the third plate thermally coupled to the first plate in the absence of an adjustable heat pipe therebetween.
16. The assembly of claim 15 , wherein the adjustable heat pipe is substantially C-shaped.
17. The assembly of claim 15 , wherein the adjustable heat pipe comprises a tubular structure, and wherein the adjustable heat pipe defines a distance between the first plate and the second plate, and wherein the distance is adjustable in a range of up to 1 mm.
18. The assembly of claim 15 , further comprising a plurality of springs positioned between the first plate and the second plate.
19. The assembly of claim 18 , wherein the third plate is coupled to the first plate in the absence of any springs therebetween.
20. The assembly of claim 1 , further comprising an additional adjustable heat pipe positioned between the first plate and the third plate.