IP Library Granted Patent US 8,772,525
Granted Patent B2
US 8,772,525 · App. 13/639,518 · Granted Jul 8, 2014

Method for preparing a diorganodihalosilane

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Quick Facts
Patent No.
US 8,772,525
App. No.
13/639,518
Granted
Jul 8, 2014
Kind
B2
Abstract

A method of preparing a diorganodihalosilane comprising the separate and consecutive steps of (i) contacting a copper catalyst with a mixture comprising hydrogen gas and a silicon tetrahalide at a temperature of from 500 to 1400° C. to form a silicon-containing copper catalyst comprising at least 0.1% (w/w) of silicon, wherein the copper catalyst is selected from copper and a mixture comprising copper and at least one element selected from gold, magnesium, calcium, cesium, tin, and sulfur; and (ii) contacting the silicon-containing copper catalyst with an organohalide at a temperature of from 100 to 600° C. to form at least one diorganodihalosilane.

Claims (23)

1. A method of preparing a diorganodihalosilane, the method comprising the following separate and consecutive steps:

(i) contacting a copper catalyst with a mixture comprising hydrogen gas and a silicon tetrahalide at a temperature of from 500 to 1400° C. to form a silicon-containing copper catalyst comprising from 1 to 5% (w/w) of silicon, wherein the copper catalyst is selected from copper and a mixture comprising copper and at least one element selected from gold, magnesium, calcium, cesium, tin, and sulfur; and

(ii) contacting the silicon-containing copper catalyst with an organohalide at a temperature of from 100 to 600° C. to form at least one diorganodihalosilane.

2. The method according to claim 1 , further comprising (iii) contacting the silicon-containing copper catalyst contacted with the organohalide in step (ii) with the mixture comprising hydrogen gas and a silicon tetrahalide at a temperature of from 500 to 1400° C. to reform the silicon containing copper catalyst comprising at least 0.1% (w/w) silicon; and (iv) contacting the reformed silicon-containing copper catalyst with the organohalide at a temperature of from 100 to 600° C. to form at least one diorganodihalosilane.

3. The method according to claim 2 , further comprising repeating steps (iii) and (iv) at least 1 time.

4. The method according to claim 2 , further comprising purging prior to the contacting of the reformed silicon-containing copper catalyst with the organohalide in step (iv).

5. The method according to claim 4 , wherein the purging is conducted with argon or silicon tetrachloride.

6. The method according to claim 1 , further comprising purging prior to contacting the silicon-containing copper catalyst with the organohalide in step (ii).

7. The method according to claim 6 , wherein the purging is conducted with argon or silicon tetrachloride.

8. The method according claim 1 , wherein the copper catalyst is supported.

9. A method of preparing a diorganodihalosilane, the method comprising the following separate and consecutive steps:

(i) contacting a copper catalyst with a mixture comprising hydrogen gas and a silicon tetrahalide at a temperature of from 500 to 1400° C. to form a silicon-containing copper catalyst comprising, from 1 to 5% (w/w) of silicon wherein the copper catalyst comprises from 0.1 to 35% (w/w) of a mixture and the mixture comprises copper, gold and magnesium, and

(ii) contacting the silicon-containing copper catalyst with an organohalide at a temperature of from 100 to 600° C. to form at least one diorganodihalosilane.

10. The method according to claim 8 , wherein the support is activated carbon.

11. The method according to claim 1 , wherein mole ratio of hydrogen to silicon tetrahalide is from 20:1 to 5:1.

12. The method according to claim 1 , wherein the silicon tetrahalide is silicon tetrachloride.

13. The method according to claim 1 , wherein the organohalide has formula Rx, where R is C 1 -C 10 alkyl or C 4 -C 10 cycloalkyl and X is fluoro, chloro, bromo, or iodo.

14. The method of claim 13 , wherein R is methyl and X is chloro.

15. The method according to claim 1 , wherein the contacting in (ii) is in the absence of hydrogen.

16. The method according to claim 1 , wherein the diorganodihalosilane has the formula R 2 SiX 2 , where R is C 1 -C 10 alkyl or C 4 -C 10 cycloalkyl and X is fluoro, chloro, bromo, or iodo.

17. The method according to claim 16 , wherein R is methyl and X is chloro.

18. The method according to claim 1 , further comprising recovering the diorganodihalosilane.

19. The method according to claim 1 , wherein the residence time of the hydrogen and silicon tetrahalide is from 0.5 to 10 s and the residence time of the organohalide is from 1 to 10 s.

Assignments (1)
CHANGE OF NAME Recorded Feb 27, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045460/0278 →