Micromachined ultrasonic transducer with air-backed cavity and electrical connection
A method and associated apparatus directed to a piezoelectric micromachined ultrasonic transducer (pMUT) defining an air-backed cavity are provided. A first via defined by a device substrate and associated dielectric layer, and extending to the first electrode, is substantially filled with a first conductive material. A support member engaged with the device substrate defines a second via extending to the first conductive material. The second via has a second conductive material disposed thereon, forms an electrically-conductive engagement with the first conductive material, and extends outwardly of the second via to be accessible externally to the support member. A connective element extends through a third via defined by a connection support substrate and is in electrically-conductive engagement with the second conductive material, wherein one of the connective element and connection support substrate is bonded to one of the support member and second conductive material by a bonding material engaged therebetween.
1. A piezoelectric ultrasonic transducer apparatus, comprising:
a transducer device disposed on a dielectric layer on a device substrate, and including a piezoelectric material disposed between a first electrode and a second electrode, the device substrate and the dielectric layer defining a first via extending to the first electrode and substantially filled with a first conductive material, the transducer device further including a support member engaged with the device substrate and the first conductive material, and defining a second via extending thereto, the second via having a second conductive material disposed thereon and forming an electrically-conductive engagement with the first conductive material, the second conductive material extending outwardly of the second via so as to be accessible externally to the support member; and
a connective element extending through a third via defined by a connection support substrate and being in electrically-conductive engagement with the second conductive material, with one of the connective element and the connection support substrate being bonded to one of the support member and the second conductive material by a bonding material engaged therebetween.
2. An apparatus according to claim 1 , wherein the connection support substrate is bonded to the support member with a non-conductive bonding material engaged therebetween.
3. An apparatus according to claim 1 , wherein the connective element is bonded to the second conductive material with one of a conductive epoxy, a conductive solder element, a conductive stud element and an anisotropically-conductive epoxy engaged therebetween.
4. An apparatus according to claim 1 , wherein the connective element is bonded to the connection support substrate with a non-conductive epoxy engaged therebetween and externally to the third via.
5. An apparatus according to claim 1 , further comprising an integrated circuit device interposed between the one of the connective element and the connection support substrate and the one of the support member and the second conductive material, the integrated circuit device being in electrically-conductive engagement with at least the connective element and the second conductive material, or being configured to facilitate an electrically-conductive engagement at least between the connective element and the second conductive material by way of a conductive element extending therethrough in a device via defined thereby.
6. A piezoelectric ultrasonic transducer apparatus, comprising:
a transducer device disposed on a dielectric layer on a device substrate, and including a piezoelectric material disposed between a first electrode and a second electrode, the device substrate and the dielectric layer defining a first via extending to the first electrode and substantially filled with a first conductive material, the transducer device further including a support member engaged with the device substrate and the first conductive material, and defining a second via extending thereto, the second via having a second conductive material disposed thereon and forming an electrically-conductive engagement with the first conductive material about an end wall of the second via; and
a connective element received into the second via defined by the support member and bonded to the support member by a bonding material engaged therebetween, the connective element being in electrically-conductive engagement with the second conductive material and spaced apart from the end wall of the second via.
7. An apparatus according to claim 6 , wherein the second conductive material is accessible externally to the support member.
8. An apparatus according to claim 6 , wherein the bonding material comprises an electrically-conductive epoxy further engaged between and in electrically-conductive engagement with the connective element and the second conductive material, externally to the second via.
9. An apparatus according to claim 6 , further comprising a connection support substrate defining a third via having the connective element inserted into and extending therethrough.
10. An apparatus according to claim 9 , further comprising an acoustic member engaged with the connection support substrate, the acoustic member defining an acoustic member via corresponding to the third via, and having the connective element inserted into and extending therethrough.