Integrated power module for multi-device parallel operation
View Patent ↗An integrated power module having a dielectric substrate, a source conductor trace formed on the dielectric substrate, a drain conductor trace formed on the dielectric substrate, a gate conductor trace formed on the dielectric substrate, a transistor chip having a top surface and a bottom surface connected to the drain conductor trace, a back-contact resistor having a flat planar structure with a top surface and a bottom surface connected to the gate conductor trace, and a first wire bond connecting the top surface of the transistor chip to the top surface of the back-contact resistor.
1. An integrated power module comprising:
a dielectric substrate;
a source conductor trace formed on the dielectric substrate;
a drain conductor trace formed on the dielectric substrate;
a gate conductor trace formed on the dielectric substrate;
a transistor chip having a top surface and a bottom surface connected to the drain conductor trace;
a back-contact resistor having a flat planar structure with a top surface and a bottom surface connected to the gate conductor trace and mounted directly on or positioned directly on the gate conductor trace; and
a first wire bond connecting the top surface of the transistor chip to the top surface of the back-contact resistor.
2. The integrated power module of claim 1 wherein the source conductor trace is spaced apart from and not in electrical contact with the drain conductor trace.
3. The integrated power module of claim 2 wherein the drain conductor trace is spaced apart from and not in electrical contact with the gate conductor trace.
4. The integrated power module of claim 1 wherein the source conductor trace, the drain conductor trace, and the gate conductor trace all lie along the same horizontal plane.
5. The integrated power module of claim 1 further comprising a case connected to the dielectric substrate, the case having side vertical walls positioned substantially perpendicular to a horizontal plane defined by the dielectric substrate.
6. The integrated power module of claim 5 further comprising a bus bar integrated into the case.
7. The integrated power module of claim 6 further comprising a second wire bond connecting the gate conductor trace to the bus bar.
8. The integrated power module of claim 1 further comprising a gate board drive having a bus bar, the gate drive board being positioned along a plane that is substantially parallel to a plane defined by the dielectric substrate.
9. The integrated power module of claim 8 further comprising a terminal pin connecting the gate conductor trace to the bus bar.
10. The integrated power module of claim 9 further comprising a chip positioned on the gate board drive and connected to the bus bar for controlling the transistor chip.
11. An integrated power module comprising:
a dielectric substrate;
a source conductor trace formed on the dielectric substrate;
a drain conductor trace formed on the dielectric substrate;
a gate conductor trace formed on the dielectric substrate;
a transistor chip having a top surface and a bottom surface connected to the drain conductor trace;
a back-contact resistor having a flat planar structure with a top surface and a bottom surface connected to the gate conductor trace and mounted directly on or positioned directly on the gate conductor trace, the back-contact resistor being positioned along a horizontal plane that is substantially parallel to a horizontal plane defined by the transistor chip; and
a first wire bond connecting the top surface of the transistor chip to the top surface of the back-contact resistor.
12. The integrated power module of claim 11 wherein the source conductor trace is spaced apart from and not in electrical contact with the drain conductor trace.
13. The integrated power module of claim 12 wherein the drain conductor trace is spaced apart from and not in electrical contact with the gate conductor trace.
14. The integrated power module of claim 11 wherein the source conductor trace, the drain conductor trace, and the gate conductor trace all lie along the same horizontal plane.
15. The integrated power module of claim 11 further comprising a case connected to the dielectric substrate, the case having side vertical walls positioned substantially perpendicular to a horizontal plane defined by the dielectric substrate.
16. The integrated power module of claim 15 further comprising a bus bar integrated into the case.
17. The integrated power module of claim 16 further comprising a second wire bond connecting the gate conductor trace to the bus bar.
18. The integrated power module of claim 11 further comprising a gate board drive having a bus bar, the gate drive board being positioned along a plane that is substantially parallel to a plane defined by the dielectric substrate.
19. The integrated power module of claim 18 further comprising a terminal pin connecting the gate conductor trace to the bus bar.
20. The integrated power module of claim 19 further comprising a chip positioned on the gate board drive and connected to the bus bar for controlling the transistor chip.