IP Library Granted Patent US 9,155,365
Granted Patent B2
US 9,155,365 · App. 13/648,693 · Granted Oct 13, 2015

Method for sublimating an image onto a substrate

Inventors: John Hong (Chicago, IL); Scott Wilson (Chicago, IL); Dustin Brown (Chicago, IL); Jon Godston (Chicago, IL)
Assignee: Uncommon LLC
A45C11/00B28B11/001B41M5/035B41M5/382B44C1/16B44C1/165B44C1/1712A45C13/08A45C2011/002B41M5/41B41M5/52
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Quick Facts
Patent No.
US 9,155,365
App. No.
13/648,693
Granted
Oct 13, 2015
Kind
B2
Abstract

A method for applying an image onto a surface (or substrate) of most any material, including thermoplastic, thermoset plastic, metal, metal alloys, wood, cellulose material, polymer, synthetic fabric, natural fabric, glass, ceramic, and combinations thereof, includes the steps of preparing a substrate for application of an image, placing the transfer sheet onto the prepared substrate, applying heat to the substrate and image sufficient to sublimate the image, allowing the image to absorb into the prepared substrate, and then curing the imaged substrate. Multiple substrates may be individually imaged and joined, if desired. One or more of the substrates may be at least partially transparent (e.g., clear, transparent or translucent) such that portions of other images, substrates or objects placed behind the one or more substrates are at least partially visible through the one or more substrates.

Claims (49)

1. A method for applying a three-dimensional image onto a substrate, the method comprising the steps of:

preparing a first substrate for application of a first layer of an image printed on a first transfer sheet, the first substrate comprising a material that is at least partially transparent;

placing the first transfer sheet onto the prepared first substrate such that the first layer of the image contacts the first substrate and is aligned with a desired position on the first substrate;

preparing a subsequent substrate for application of a subsequent layer of the image printed on a subsequent transfer sheet;

placing the subsequent transfer sheet onto the prepared subsequent substrate such that the subsequent layer of the image contact the subsequent substrate and is aligned with a desired position on the subsequent substrate;

applying heat to the first substrate and first transfer sheet sufficient to sublimate the first layer of the image;

applying heat to the subsequent substrate and subsequent transfer sheet sufficient to sublimate the subsequent layer of the image;

allowing the first layer of the image to absorb into the prepared first substrate;

allowing the subsequent layer of the image to absorb into the prepared subsequent substrate;

curing the first substrate;

curing the subsequent substrate;

aligning the first substrate with the subsequent substrate; and

attaching the first substrate to the subsequent substrate;

wherein the step of aligning the first substrate with the subsequent substrate is performed before the steps of applying heat to the first substrate and applying heat to the subsequent substrate.

2. A method for applying a three-dimensional image onto a substrate, the method comprising the steps of:

preparing a first substrate for application of a first layer of an image printed on a first transfer sheet;

placing the first transfer sheet onto the prepared first substrate such that the first layer of the image contacts the first substrate and is aligned with a desired position on the first substrate;

preparing a subsequent substrate for application of a subsequent layer of the image printed on a subsequent transfer sheet;

placing the subsequent transfer sheet onto the prepared subsequent substrate such that the subsequent layer of the image contact the subsequent substrate and is aligned with a desired position on the subsequent substrate;

applying heat to the first substrate and first transfer sheet sufficient to sublimate the first layer of the image;

applying heat to the subsequent substrate and subsequent transfer sheet sufficient to sublimate the subsequent layer of the image;

allowing the first layer of the image to absorb into the prepared first substrate;

allowing the subsequent layer of the image to absorb into the prepared subsequent substrate;

curing the first substrate;

curing the subsequent substrate;

aligning the first substrate with the subsequent substrate; and

attaching the first substrate to the subsequent substrate;

wherein the step of aligning the first substrate with the subsequent substrate is performed before the steps of applying heat to the first substrate and applying heat to the subsequent substrate.

3. The method of claim 2 , wherein the first substrate is comprised substantially of a material selected from the group consisting of thermoplastic, thermoset plastic, metal, metal alloys, wood, cellulose material, polymer, synthetic fabric, natural fabric, glass, ceramic, and combinations thereof.

4. The method of claim 2 , further comprising the step of concealing imperfections on the first substrate.

5. The method of claim 4 , wherein the step of concealing imperfections comprises placing the transfer sheet over imperfections.

6. The method of claim 2 , wherein the subsequent substrate is comprised substantially of a material selected from the group consisting of thermoplastic, thermoset plastic, metal, metal alloys, wood, cellulose material, polymer, synthetic fabric, natural fabric, glass, ceramic, and combinations thereof.

7. The method of claim 6 , wherein the first substrate and the subsequent substrate are comprised of the same material.

8. The method of claim 6 , wherein the first substrate and the subsequent substrate are comprised of different materials.

9. The method of claim 2 , wherein aligning the first imaged substrate with the subsequent imaged substrate comprises aligning the first imaged substrate on top of the subsequent imaged substrate such that at least a portion of the subsequent imaged substrate is visible through the first imaged substrate.

10. The method of claim 2 , wherein the subsequent substrate is at least partially comprised of a material that is at least partially transparent.

11. The method of claim 2 , further comprising the steps of:

aligning the first imaged substrate with an object such that at least a portion of the object in visible through the first imaged substrate.

12. The method of claim 2 , wherein the transfer sheet is at least partially transparent such that at least a portion of the first substrate is visible through the transfer sheet after the transfer sheet has been placed onto the prepared first substrate.

13. The method of claim 2 , wherein the first substrate is larger than the transfer sheet such that at least a portion of the first substrate is not covered by the transfer sheet after the transfer sheet has been placed onto the prepared first substrate.

14. The method of claim 1 , wherein the steps of applying heat to the first substrate and applying heat to the subsequent substrate are performed concurrently.

15. The method of claim 1 , wherein the steps of curing the first substrate and curing the subsequent substrate are performed concurrently.

16. The method of claim 1 , wherein the step of attaching the first substrate to the subsequent substrate is performed concurrently with the steps of applying heat to the first substrate and applying heat to the subsequent substrate.

17. The method of claim 16 , wherein the step of attaching the first substrate to the subsequent substrate comprises applying heat to the first substrate and the second substrate to bond the first and subsequent substrates to each other.

18. The method of claim 2 , wherein the step of preparing a first substrate comprises the step of applying a liquid adhesion material to a surface of the first substrate.

19. The method of claim 2 , wherein the steps of applying heat to the first substrate and applying heat to the subsequent substrate are performed concurrently.

20. The method of claim 2 , wherein the steps of curing the first substrate and curing the subsequent substrate are performed concurrently.

21. The method of claim 2 , wherein the step of attaching the first substrate to the subsequent substrate is performed concurrently with the steps of applying heat to the first substrate and applying heat to the subsequent substrate.

22. The method of claim 21 , wherein the step of attaching the first substrate to the subsequent substrate comprises applying heat to the first substrate and the second substrate to bond the first and subsequent substrates to each other.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2024
From: UNCOMMON LLC
To: TECH-SESSORIES, INC.
Reel/Frame 069615/0354 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2013
From: WILSON, SCOTT; BROWN, DUSTIN; GODSTON, JON
To: UNCOMMON LLC
Reel/Frame 029566/0576 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2013
From: HONG, JOHN
To: UNCOMMON LLC
Reel/Frame 029566/0752 →
Continuity (3)
Continuation In Part 12855311 · Aug 12, 2010
Provisional Application 61233146 · Aug 12, 2009
Related Publication 20130032049A1 · Feb 7, 2013