IP Library Granted Patent US 8,426,237
Granted Patent B2
US 8,426,237 · App. 13/649,367 · Granted Apr 23, 2013

Assembly techniques for solar cell arrays and solar cells formed therefrom

Inventors: Raymond Chan (Hoffman Estates, IL); Christopher Youtsey (Libertyville, IL)
Assignee: MicroLink Devices, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,426,237
App. No.
13/649,367
Granted
Apr 23, 2013
Kind
B2
Abstract

An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.

Claims (12)

1. A method for forming an array of solar cells, the method comprising:

providing a plurality of solar cells, wherein a solar cell includes a semiconductor layer formed on top of a backmetal layer leaving a portion of a top surface of the backmetal layer exposed;

applying an adhesive to a film layer;

placing the plurality of solar cells onto the film layer;

interconnecting the plurality of solar cells using one or more interconnect tabs by coupling the exposed top surface of the backmetal layer of a first solar cell to a top surface of an adjacent second solar cell;

applying adhesive on the plurality of interconnected solar cells; and

laminating a top film to the plurality of interconnected solar cells to form an array of solar cells.

2. The method of claim 1 , wherein interconnecting the plurality of solar cells further includes:

attaching one or more bypass diodes to a top side of the solar cell; and

attaching the one or more interconnect tabs to the top side of the solar cell.

3. The method of claim 1 , wherein the one or more bypass diodes and the one or more interconnect tabs are attached to the top side of the solar cell by welding the one or more bypass diodes and the one or more interconnect tabs from the top side of the solar cell.

4. The method of claim 1 , wherein the first solar cell is in a serial connection or a parallel connection with the adjacent second solar cell.

Assignments (2)
CONFIRMATORY LICENSE Recorded Feb 19, 2015
From: MICROLINK DEVICES
To: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY
Reel/Frame 035048/0604 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2012
From: CHAN, RAYMOND; YOUTSEY, CHRISTOPHER
To: MICROLINK DEVICES, INC.
Reel/Frame 029252/0985 →
Continuity (3)
Division 12773582 · May 4, 2010
Provisional Application 61175259 · May 4, 2009
Related Publication 20130034926A1 · Feb 7, 2013