POP structures and methods of forming the same
A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.
1. A device comprising:
a bottom package comprising:
a molding material;
a first device die molded in the molding material, wherein the first device die comprises metal posts, with the molding material disposed into gaps between the metal posts;
a Through Assembly Via (TAV) penetrating through the molding material; and
a first redistribution line over the molding material; and
a top package comprising a discrete passive device packaged therein, wherein the top package is over and bonded to the bottom package, and wherein the discrete passive device is electrically coupled to the first redistribution line.
2. The device of claim 1 , wherein the discrete passive device is a discrete capacitor.
3. The device of claim 1 further comprising a second device die molded in the molding material, wherein the first device die and the second device die are level with each other.
4. The device of claim 3 , wherein the first device die comprises first electrical connectors, the second device die comprises second electrical connectors, and wherein ends of the first electrical connectors and ends of the second electrical connectors are level with a surface of the molding material.
5. The device of claim 3 , wherein the first device die and the second device die are selected from the group consisting essentially of a Power Management Integrated Circuit (PMIC) die, a Transceiver (TRX) die, and a base band die.
6. The device of claim 1 further comprising a second redistribution line on an opposite side of the molding material than the first redistribution line, wherein the second redistribution line is electrically coupled to the first redistribution line through the TAV.
7. The device of claim 1 further comprising:
an additional device die comprised in the top package, wherein the additional device die is bonded to the bottom package through a solder region, with the solder region being over the first redistribution line; and
an additional TAV in the molding material and electrically coupled to the additional device die.
8. The device of claim 1 , wherein bottom surfaces of the metal posts are coplanar with a bottom surface of the molding material.
9. The device of claim 1 , wherein the metal posts comprise vertical edges.
10. The device of claim 1 , wherein the discrete passive device is over and bonded to the first redistribution line through solder bonds, and wherein the device further comprises an additional molding material between the solder bonds.
11. A device comprising:
a bottom package comprising:
a molding material;
a first device die molded in the molding material;
a Through Assembly Via (TAV) penetrating through the molding material; and
a first redistribution line over the molding material;
a top package over and bonded to the bottom package, wherein the top package comprises:
an additional electrical device electrically coupled to the first redistribution line; and
an additional molding compound molding the additional electrical device therein, wherein the additional molding compound is in direct contact with a second redistribution line that is over the molding material.
12. The device of claim 11 , wherein the additional electrical device is a discrete passive device.
13. The device of claim 11 further comprising a second device die molded in the molding material, wherein the first device die and the second device die are level with each other.
14. The device of claim 11 , wherein the first device die comprises metal posts, and wherein the molding material is disposed into gaps between the metal posts.
15. The device of claim 14 , wherein bottom surfaces of the metal posts are coplanar with a bottom surface of the molding material.
16. The device of claim 11 , wherein the additional electrical device is an additional device die, and wherein the additional device die is directly bonded to the second redistribution line.
17. The device of claim 11 , wherein the additional electrical device is over the second redistribution line, and wherein the device further comprises a solder region between, and electrically inter-coupling, the additional electrical device and the second redistribution line.