Methods and apparatus toward preventing ESC bonding adhesive erosion
Embodiments of the present invention provide chamber components having a protective element for shielding bonding material from processing environments in a processing environment. The protective element may include protective seals, protective structures, erosion resistive fillers, or combinations thereof. Embodiments of the present invention reduce erosion of bonding material used in a processing chamber, thus, improving processing quality and reducing maintenance costs.
1. An electrostatic chuck for a processing chamber, comprising:
a chuck body having an upper surface configured to support a substrate thereon and a lower surface opposite the upper surface;
a chuck base having an upper surface facing the lower surface of the chuck body;
a bonding material joining the lower surface of the chuck body and the upper surface of the chuck base;
a passageway through the chuck body, the chuck base and the bonding material, wherein the passageway is formed by internal surfaces of the chuck body, the chuck base and the bonding material; and
a protective element which is positioned in the passageway to prevent line of sight exposure of the bonding material to an environment exterior to the electrostatic chuck.
2. The electrostatic chuck of claim 1 , wherein the protective element comprises a protective seal disposed between the lower surface of the chuck body and the upper surface of the chuck base, the protective seal surrounding the bonding material.
3. The electrostatic chuck of claim 2 , wherein the protective element further comprises a protective seal disposed within the passageway, and the protective seal is configured for a lift pin to travel therethrough.
4. The electrostatic chuck of claim 2 , wherein the protective seal is disposed in a recess formed between the chuck base and the chuck body.
5. The electrostatic chuck of claim 4 , wherein the recess is defined by the lower surface of the chuck body and a step formed at the upper surface of the chuck base.
6. The electrostatic chuck of claim 4 , wherein the recess is defined by the upper surface of the chuck base and a step formed at the lower surface of the chuck body.
7. The electrostatic chuck of claim 4 , wherein the recess is defined by a first step formed on the lower surface of the chuck body and a second step formed on the upper surface of the chuck base.
8. The electrostatic chuck of claim 1 , wherein the protective element comprises a protective structure formed in at least one of the chuck body and the chuck base, the protective element covering the bonding material.
9. The electrostatic chuck of claim 8 , wherein the protective structure comprises a continuous lip extending from the lower surface of the chuck body towards the chuck base and surrounding an edge region of the bonding material.
10. The electrostatic chuck of claim 9 , wherein the protective structure further comprises a groove formed in the chuck base and configured to receive the continuous lip therein.
11. The electrostatic chuck of claim 1 , wherein the protective element comprises an erosion resistive filler disposed in the bonding material.