Thermosetting resin composition, cured product thereof, and printed wiring board using the same
Provided are: a thermosetting resin composition in which a cured product is excellent in low warp properties, thermal cycle characteristics, and the like, and occurrence of cracking of a coating film in a B-stage state is suppressed; a cured product thereof; and a printed wiring board in which the cured product is used. The thermosetting resin composition comprises: (A) an epoxy resin; (B) a curing agent for an epoxy resin; (C) spherical silicon dioxide and/or spherical aluminum oxide; and (D) a block copolymer.
1. A thermosetting resin composition, comprising:
an epoxy resin;
a curing agent for the epoxy resin;
spherical silicon dioxide and/or spherical aluminum oxide; and
a block copolymer,
wherein the block copolymer has a weight average molecular weight, Mw, of 50000 or more and 300000 or less and a molecular weight distribution, Mw/Mn, of 3 or less, and the spherical silicon dioxide and/or spherical aluminum oxide are included in an amount of 50 wt % or more based on a total thermosetting resin composition.
2. The thermosetting resin composition according to claim 1 , wherein the molecular weight distribution of the block copolymer is 2.5 or less.
3. The thermosetting resin composition according to claim 1 , wherein the block copolymer is a block copolymer represented by formula (I):
X—Y—X (I)
where X is a polymer unit having a glass transition point Tg of 0° C. or more; and
Y is a polymer unit having a glass transition point Tg of less than 0° C.
4. The thermosetting resin composition according to claim 3 , wherein in the formula (I),
Y comprises poly-n-butyl(meth)acrylate; and
X comprises polymethyl(meth)acrylate.
5. The thermosetting resin composition according to claim 1 , wherein the curing agent is a phenolic resin.
6. A thermosetting film obtained by a process comprising applying and drying, onto a film, the thermosetting resin composition according to claim 1 .
7. A cured product prepared by a process comprising heating and curing the thermosetting resin composition according to claim 1 or a thermosetting film obtained by a process comprising applying and drying, onto a film, the thermosetting resin composition.
8. The thermosetting resin composition according to claim 1 , wherein the molecular weight distribution of the block copolymer is 2.0 or less.
9. The thermosetting resin composition according to claim 1 , wherein the epoxy resin is included in an amount of 20 to 80 mass % based on a total solid of the thermosetting resin composition.
10. The thermosetting resin composition according to claim 1 , wherein the epoxy resin is included in an amount of 20 to 60 mass % based on a total solid of the thermosetting resin composition.
11. The thermosetting resin composition according to claim 10 , wherein the curing agent is included in an amount of 0.3 to 1.5 mol based on one mol of the epoxy resin.
12. The thermosetting resin composition according to claim 11 , wherein the spherical silicon dioxide and spherical aluminum oxide are included in an amount of 50 wt % or more based on a total thermosetting resin composition.
13. The thermosetting resin composition according to claim 11 , wherein the block copolymer is included in an amount of 5 to 35 parts by mass in a solid content based on 100 parts by mass of the epoxy resin.
14. The thermosetting resin composition according to claim 13 , wherein in the formula (I), Y comprises poly-n-butyl(meth)acrylate, and X comprises polymethyl(meth)acrylate.
15. The thermosetting resin composition according to claim 14 , wherein the curing agent is a phenolic resin.
16. The thermosetting resin composition according to claim 15 , wherein the spherical silicon dioxide and the spherical aluminum oxide are present.
17. A printed wiring board, comprising:
a cured product prepared by heating and curing a thermosetting resin composition applied to a printed wiring board, or a film obtained by coating and drying a thermosetting resin composition onto a carrier film, applying the film to a printed wiring board, and heating and curing the film,
wherein thermosetting resin composition comprises
an epoxy resin,
a curing agent for the epoxy resin,
spherical silicon dioxide and/or spherical aluminum oxide, and
a block copolymer having a weight average molecular weight, Mw, of 50000 or more and 300000 or less and a molecular weight distribution, Mw/Mn, of 3 or less.