Semiconductor light emitting device
View Patent ↗A semiconductor light emitting device includes a substrate having a main surface and an exposed surface; an epitaxial structure, disposed on the main surface of the substrate, having at least a first type semiconductor layer, a light-emitting layer, and a second type semiconductor layer, wherein the first type layer has a first sidewall including at least a first etched surface and a second etched surface, wherein angles between the etched surfaces and the exposed surface are acute angles; and an electrode structure disposed on the epitaxial structure.
1. A semiconductor light-emitting device, comprising:
a substrate comprising a main surface and an exposed surface, wherein the main surface and the exposed surface comprise concavo-convex structures;
an epitaxial structure disposed on the main surface of the substrate comprising a first type semiconductor layer, a light-emitting layer, a second type semiconductor layer, a buffer layer disposed between the first type semiconductor layer and a nucleation layer and the nucleation layer disposed between the substrate and the buffer layer;
an electrode structure disposed on the epitaxial structure;
wherein an upper part of the first type semiconductor layer comprises a first sidewall comprising a first etched surface so that a first angle between the first etched surface and the exposed surface is acute;
wherein a bottom part of the first type semiconductor layer, the buffer layer, and the nucleation layer comprises a second sidewall comprising a second etched surface so that a second angle between the second etched surface and the exposed surface is also acute which is narrower than the first angle,
wherein an angle inside the epitaxial structure between the first etched surface and the second etched surface is between 90° and 180°,
wherein highest light intensity is usually at emission angles of 60° and 120° and the light intensity is gradually reduced toward emission angles of 0° and 180°.
2. The semiconductor light-emitting device according to claim 1 , wherein the buffer layer is a nitride material doped with aluminum.
3. The semiconductor light-emitting device according to claim 1 , wherein the first etched surface is not parallel to the second etched surface.
4. The semiconductor light-emitting device according to claim 1 , wherein the first etched surface is adjacent to the second etched surface.