IP Library Granted Patent US 8,654,350
Granted Patent B2
US 8,654,350 · App. 13/672,742 · Granted Feb 18, 2014

Inspecting method and inspecting apparatus for substrate surface

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Quick Facts
Patent No.
US 8,654,350
App. No.
13/672,742
Granted
Feb 18, 2014
Kind
B2
Abstract

An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.

Claims (24)

1. An inspecting method for inspecting a substrate surface, characterized by including:

a first step of illuminating a light to the substrate surface having a film;

a second step of detecting a scattered light or reflected light from a plurality of positions of the substrate surface and obtaining a plurality of electrical signals;

a third step of comparing the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness; and

a fourth step of calculating a surface roughness value based on the result of comparing of the third step; and

wherein the relationship between electrical signals and surface roughness stored in the data base is a relationship based on frequency components of surface roughness corresponding to light diffraction of the light illuminated on the substrate surface.

2. The inspecting method according to claim 1 , wherein the database is obtained beforehand by measurement or simulation of another substrate for which surface roughness is known.

3. The inspecting method according to claim 1 , characterized in that the third step includes comparing the plurality of electrical signals and a database which indicates a relationship between the electrical signals and film thickness;

characterized in that the fourth step includes calculating a film thickness based on the result of comparing of the third step.

4. The inspecting method according to claim 1 , characterized in that the third step includes comparing the plurality of electrical signals and a database which indicates a relationship between the electrical signals and film materials;

characterized in that the fourth step includes determining a film material based on the result of comparing of the third step.

5. The inspecting method according to claim 1 , wherein the database indicates a relationship between the electrical signals of a respective detector and surface roughness.

6. The inspecting apparatus according to claim 1 , characterized in that the comparator includes a comparing device which compares the plurality of electrical signals and a database which indicates a relationship between the electrical signals and film thickness;

characterized in that the calculator calculates a film thickness based on the result of comparing of the comparing device.

7. An inspecting apparatus for inspecting a substrate surface, characterized by including:

an illuminator which illuminates a light to the substrate surface having a film;

at least one detector which detects a scattered light or reflected light from a plurality of positions of the substrate surface for obtaining a plurality of electrical signals;

a comparator which compares the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness; and

a calculator which calculates a surface roughness value based on the result of comparing of the comparator,

wherein the relationship between electrical signals and surface roughness stored in the data base is a relationship based on frequency components of surface roughness corresponding to light diffraction of the light illuminated on the substrate surface.

8. The inspecting apparatus according to claim 7 , wherein the database is obtained beforehand by measurement or simulation of another substrate for which surface roughness is known.

9. The inspecting apparatus according to claim 7 , characterized in that the comparator includes a comparing device which compares the plurality of electrical signals and a database which indicates a relationship between the electrical signals and film materials;

characterized in that the calculator determines a film material based on the result of comparing of the comparing device.

10. The inspecting apparatus according to claim 7 , wherein the database indicates a relationship between the electrical signals of a respective detector and surface roughness.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →