Method of fabricating an organic light emitting diode (OLED) display
An organic light emitting diode display and a method of fabricating the same are disclosed. In one embodiment, the method includes providing a base substrate including a first device region and a first encapsulation region, wherein the first encapsulation region is located on both sides of the first device region and forming an organic light emitting diode (OLED) on the first device region. The method further includes providing an encapsulation substrate including a second device region and a second encapsulation region corresponding to the first device region and first encapsulation region, respectively, forming a light transmission layer on the second device region and forming an inner filler on the light transmission layer.
1. A method of fabricating on organic light emitting diode (OLED) display, comprising:
providing abase substrate including a first device region and a first encapsulation region, wherein the first encapsulation region is located on both sides of the first device region;
forming an organic light emitting diode (OLED) on the first device region;
providing an encapsulation substrate including a second device region and a second encapsulation region corresponding to the first device region and first encapsulation region, respectively;
forming a light transmission layer on the second device region;
forming an inner filler on the light transmission layer;
providing an encapsulation agent on the first and second encapsulation regions; and encapsulating the base substrate with the encapsulation substrate via the encapsulation agent,
wherein the light transmission layer has a refractive index ranging from about 1.75 to about 1.85.
2. The method according to claim 1 , further comprising:
forming a protection layer surrounding the OLED subsequent to forming the OLED.
3. The method according to claim 1 , further comprising:
forming a sealant portion on the second encapsulation region subsequent to forming the light transmission layer.
4. The method according to claim 3 , wherein providing the encapsulation agent comprises disposing the encapsulation agent outside the sealant portion.
5. The method according to claim 1 , wherein the encapsulation agent is a glass frit, and wherein the encapsulation comprises applying laser light to the glass frit to melt and solidify the glass frit.
6. The method according to claim 5 , wherein the glass frit includes one selected from the group consisting of lead oxide (PbO), diboron trioxide (B 2 O 3 ) and silicon dioxide (SiO 2 ).
7. The method according to claim 1 , wherein the light transmission layer is formed to a thickness ranging from about 630 Å to about 770 Å.