Semiconductor device and method of manufacturing the same
To provide a technique adopting a TSV technique, capable of improving manufacturing yield and reliability of semiconductor devices. By partitioning a connection pad-forming region into a plurality of regions and by forming, respectively, connection pads 17 having a relatively small planar area, spaced apart from an adjacent connection pad 17 in each of partitioned regions, dishing generated in the connection pad 17 is lightened. In addition, by not forming a through hole 23 for forming a through electrode 27 in an interlayer insulating film 9 covering a semiconductor element, intrusion of H 2 O, a metal ion such as Na + or K + , etc. into an element-forming region from the through hole, via the interlayer insulating film is prevented.
1. A semiconductor device, comprising:
a semiconductor substrate having a first main surface and a second main surface opposite to the first main surface;
a through hole passing through the semiconductor substrate from the first main surface to the second main surface;
a through electrode formed inside the through hole;
a MISFET formed over the first main surface of the semiconductor substrate, the MISFET having a semiconductor region in the semiconductor substrate on a side of the first main surface;
an insulating film formed over the MISFET;
multilayer wirings formed over the insulating film, said multilayer wirings being electrically coupled to the semiconductor region;
a plurality of connection pads formed over the insulating film, the connection pads formed at the lowest wiring layer of the multilayer wirings; and
a plurality of connection electrodes formed inside a plurality of connection holes formed in the insulating film,
wherein the plurality of connection pads are electrically coupled to the through electrode via the plurality of connection electrodes, respectively.
2. The semiconductor device according to claim 1 ,
wherein the connection electrode has a shape in which a first dimension in a first direction is the same as a second dimension in a second direction orthogonal to the first direction, in plan view, and each of the connection pads is electrically coupled to the through electrode via the connection electrodes.
3. The semiconductor device according to claim 2 ,
wherein a shape of the connection electrodes viewed from above is circular respectively.
4. The semiconductor device according to claim 1 ,
wherein the connection electrodes have a shape having a first dimension in a first direction and a second dimension larger than the first dimension in a second direction orthogonal to the first direction respectively, in plan view, and each of the connection pads is electrically coupled to the through electrode via the connection electrodes.
5. The semiconductor device according to claim 1 ,
wherein the connection electrodes have a shape of a lattice type, respectively, in plan view, and each of the connection pads is electrically coupled to the through electrode via the connection electrodes.
6. The semiconductor device according to claim 1 , wherein the connection electrode is constituted by a metal film of the same layer as the connection pad.
7. The semiconductor device according to claim 1 , wherein a metal silicide layer is formed between the connection electrode and the through electrode.
8. The semiconductor device according to claim 1 , wherein the connection electrode protrudes inside the through electrode.
9. A semiconductor device, comprising:
a semiconductor substrate having a first main surface and a second main surface opposite to the first main surface;
a through hole passing through the semiconductor substrate from the first main surface to the second main surface;
a through electrode formed inside the through hole;
a MISFET formed over the first main surface of the semiconductor substrate, the MISFET having a semiconductor region in the semiconductor substrate on a side of the first main surface;
an insulating film formed over the MISFET;
multilayer wirings formed over the insulating film, said multilayer wirings being electrically coupled to the semiconductor region;
a connection pad that is formed over the insulating film and has a shape of a lattice type in plan view, the connection pads formed at a lowest wiring layer of the multilayer wirings; and
a plurality of connection electrodes formed inside a plurality of connection holes formed in the insulating film,
wherein the connection pad is electrically coupled to the through electrode via the plurality of connection electrodes.
10. The semiconductor device according to claim 9 , wherein the connection electrode is constituted by a metal film of the same layer as the connection pad.
11. The semiconductor device according to claim 9 , wherein a metal silicide layer is formed between the connection electrode and the through electrode.
12. The semiconductor device according to claim 9 , wherein the connection electrode protrudes inside the through electrode.
13. The semiconductor device according to claim 1 , wherein one of the plurality of connection pads is electrically coupled to the through electrode via two or more of the plurality of connection electrodes.
14. The semiconductor device according to claim 1 ,
wherein the plurality of connection pads are directly coupled to the plurality of connection electrodes respectively, and
wherein the plurality of connection electrodes are directly coupled to the through electrode.
15. The semiconductor device according to claim 9 ,
wherein the connection pad is directly coupled to the plurality of connection electrodes, and
wherein the plurality of connection electrodes are directly coupled to the through electrode.